Wiring Substrate Resin Deformation During Brazing
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Solution Overview
Problem
Existing wiring substrates for electronic component inspection apparatus face issues such as resin deformation during brazing, accidental short circuits between brazing material layers and external connection terminals, and disconnection due to resin adhesive covering external connection terminals, especially at high densities and under external forces.
Innovation Solution
A wiring substrate design featuring a first laminate of resin layers with probe pads and a second laminate of ceramic layers, where studs are brazed to metal layers on the ceramic laminate using a brazing material with a thermal deformation temperature of 300° C or higher, and a brazing material layer with controlled extension lengths to prevent deformation and short circuits, while ensuring accurate stud positioning for probe pin contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing is used to join studs to the back surface of the ceramic laminate, then strong mechanical connection is achieved, but resin layers may deform due to softening or melting from high temperature
Solution Approach 1:
The patent changes the thermal parameter of the resin material by selecting a resin with a glass transition temperature (Tg) of 200°C or higher. This parameter change allows the resin to withstand the high temperatures of the brazing process (typically 200-400°C) without deforming, thus resolving the contradiction between achieving strong mechanical connection through brazing and preventing resin layer deformation.
2Area of stationary object
If via conductors are located close to studs on the back surface, then space utilization is improved, but cracking may occur in the vicinity of via conductors under external force
Solution Approach 1:
The patent applies local quality by specifying different structural characteristics in different regions: the brazing material layer is designed with controlled extension that deliberately avoids the vicinity of via conductors, creating a local quality difference where the brazing material extends closer to via conductors on one side but maintains safe distances on other sides. This localized structural optimization allows space utilization while preventing cracking at via conductor locations under external force.
3Ease of manufacture
If resin adhesive is used to join studs, then ease of manufacture is improved, but external connection terminals may be covered resulting in disconnection
Solution Approach 1:
The patent introduces the brazing material layer as an intermediary substance between the stud and the substrate. This brazing material serves dual functions: it provides strong mechanical bonding (ease of manufacture) and, when properly controlled in its extension, it does not cover the external connection terminals, thus maintaining electrical connection reliability. The brazing material acts as a mediator that resolves the contradiction between manufacturing ease and connection reliability.
4Adaptability or versatility
If multiple resin insulation layers are laminated with multiple ceramic layers, then functional integration is improved, but resin deformation occurs during brazing of studs
Solution Approach 1:
The patent resolves this contradiction by changing the thermal parameter of the resin material, specifically selecting a resin with a glass transition temperature (Tg) of 200°C or higher. This parameter change enables the resin insulation layers to maintain their shape and structural integrity during the brazing process, even though multiple layers are laminated together for functional integration. The high Tg resin withstands the brazing temperature without deforming, thus preserving both functional integration and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents resin deformation, reduces short circuit formation, and ensures reliable electrical connections and accurate positioning of probe pins for precise electronic component inspection, maintaining structural integrity and preventing disconnection.
Implementation Method 1
a plurality of studs joined to a back surface of the second laminate via respective brazing material layers
Data Source
AI summary
[Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.[Means for Solution] A wiring substrate for electronic component inspection apparatus 1 which includes a first laminate 3 composed of a plurality of stacked resin layers j1 to j3 and having a plurality of pads for probe 9 on its front surface 5, a second laminate 4 disposed on a back surface 6 side of the first laminate 3 and composed of a plurality of stacked ceramic layers c1 to c3, and a plurality of studs 20a joined to a back surface 8 of the second laminate 4 and in which the resin layers j1 to j3 of the first laminate 3 are formed of a resin having a thermal deformation temperature of 300° C. or higher, and the studs 20a are joined to surfaces of metal layers 16 formed on the back surface 8 of the second laminate 4 via brazing material layers 28, respectively.