Wiring Substrate Resin Surface Uniform Relative Permittivity

Solution Overview

Problem

Conventional wiring substrates with insulating layers for build-up face challenges in achieving uniform relative permittivity and signal propagation speed due to exposed insulating particles, leading to noise and inefficiencies in signal transmission.

Innovation Solution

A wiring substrate design featuring insulating layers formed of inorganic particles and resin, where the surface of the insulating layers is covered by a resin layer, preventing exposure of inorganic particles and ensuring uniform relative permittivity, combined with conductor layers and via conductors that connect components efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If insulating layers are formed with inorganic particles exposed on the surface, then the insulating layers provide structural integrity and electrical insulation, but the relative permittivity becomes non-uniform causing noise and signal transmission inefficiencies

Engineering Contradiction:

Improvesignal transmission stabilityVSAvoidrelative permittivity uniformity

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating a dual-surface structure where the first surface (contacting conductor layers) has uniform resin composition for electrical stability, while the second surface (exposed to environment) maintains the inorganic particle structure for mechanical integrity. This localized differentiation resolves the contradiction between electrical uniformity and structural stability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating layer is segmented into two distinct surfaces with different compositions: the first surface is formed of resin only for uniform electrical properties, while the second surface retains inorganic particles for structural support. This segmentation allows each surface to optimize for its specific function, resolving the uniformity-reliability contradiction.

Inventive Principle:

Principle #1Segmentation

2Productivity

If inorganic particles are exposed on the insulating layer surface, then manufacturing is simpler and structural strength is maintained, but signal propagation speed becomes non-uniform across different wiring patterns

Engineering Contradiction:

Improvesignal transmission efficiencyVSAvoidsignal propagation uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating a dual-surface structure where the first surface (contacting conductor layers) has uniform resin composition for electrical stability, while the second surface (exposed to environment) maintains the inorganic particle structure for mechanical integrity. This localized differentiation resolves the contradiction between electrical uniformity and structural stability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating layer is segmented into two distinct surfaces with different compositions: the first surface is formed of resin only for uniform electrical properties, while the second surface retains inorganic particles for structural support. This segmentation allows each surface to optimize for its specific function, resolving the uniformity-reliability contradiction.

Inventive Principle:

Principle #1Segmentation

3Stability of the object's composition

If the insulating layer surface is covered with resin to prevent particle exposure, then relative permittivity uniformity is achieved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improverelative permittivity uniformityVSAvoidinsulating layer structure

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating a dual-surface structure where the first surface (contacting conductor layers) has uniform resin composition for electrical stability, while the second surface (exposed to environment) maintains the inorganic particle structure for mechanical integrity. This localized differentiation resolves the contradiction between electrical uniformity and structural stability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating layer is segmented into two distinct surfaces with different compositions: the first surface is formed of resin only for uniform electrical properties, while the second surface retains inorganic particles for structural support. This segmentation allows each surface to optimize for its specific function, resolving the uniformity-reliability contradiction.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20240196526A1Wiring substrate

Publication Date: 2024.06.13 IBIDEN CO LTD

AI summary

A wiring substrate includes insulating layers including inorganic particles and resin, conductor layers formed on first surfaces of the insulating layers, respectively, and including the outermost conductor layer and a conductor layer, and via conductors formed in the insulating layers such that the via conductors are connecting the conductor layers formed on the first surfaces of the insulating layers. The conductor layers are formed such that the outermost conductor layer includes first conductor pads positioned to mount a first component and second conductor pads positioned to mount a second component and that the conductor layer includes first wiring patterns connecting the first conductor pads and the second conductor pads, and the insulating layers are formed such that the first surfaces of the insulating layers are formed of the resin and do not have exposed surfaces of the inorganic particles.