Wiring Substrate Rigid Support Layer Warping Prevention
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Solution Overview
Problem
Thin wiring substrates with low rigidity from photosensitive resin interlayer insulation layers are prone to warping, making them difficult to handle during manufacturing.
Innovation Solution
A wiring substrate design featuring a stack of alternately layered insulation and wiring layers, with a higher rigidity first insulation layer covering the lower surface and side surfaces of the stack, formed from a thermosetting resin to enhance mechanical strength and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin film of photosensitive resin is used as interlayer insulation layer to reduce substrate thickness, then the wiring substrate achieves thinner profile and higher wiring pattern density, but the substrate rigidity decreases causing warping and handling difficulty
Solution Approach 1:
The patent uses a composite structure combining a thin photosensitive resin film (for insulation) with a separate rigid support substrate (for mechanical strength). The support substrate has higher rigidity than the insulating film, creating a composite system that achieves both thinness and structural stability, preventing warping while maintaining handling capability
Solution Approach 2:
The substrate is segmented into functionally distinct layers: a thin interlayer insulation layer made of photosensitive resin for electrical insulation and a separate support substrate for mechanical support. This segmentation allows each layer to optimize its specific function without compromising the other, enabling thin profile while maintaining rigidity
2Length of moving object
If a thin film of photosensitive resin is used as interlayer insulation layer to reduce substrate thickness, then the wiring substrate achieves thinner profile, but handling during manufacturing becomes difficult due to low rigidity
Solution Approach 1:
By combining the thin photosensitive resin film with a rigid support substrate, the composite structure provides sufficient mechanical strength for easy handling during manufacturing processes while maintaining the desired thin overall profile of the wiring substrate
Solution Approach 2:
The support substrate acts as an intermediary element that mediates between the thin insulating film and the handling requirements. It provides the necessary mechanical support during manufacturing operations without interfering with the electrical insulation function of the photosensitive resin layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the rigidity of the wiring substrate, reducing warping and bending, and improves handling during manufacturing by providing a robust structure that maintains adhesion and connection reliability.
Implementation Method 1
Each of the plurality of insulation layers is formed by an insulative resin of which main component is a photosensitive resin
Data Source
AI summary
A wiring substrate includes a stack having a plurality of insulation layers and a plurality of wiring layers. Each of the plurality of insulation layer is formed by an insulative resin of which main component is a photosensitive resin. The plurality of insulation layers and the plurality of wiring layers are alternately stacked one upon another. The wiring substrate further includes a first insulation layer covering a lower surface of the stack and entirely covering a side surface of the stack. The first insulation layer has a higher rigidity than the plurality of insulation layers. An upper surface of the uppermost one of the plurality of wiring layers and an upper surface of the uppermost one of the plurality of insulation layers are exposed from the first insulation layer.