Wiring Substrate Adhesion via Controlled Surface Roughness
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates face challenges in achieving optimal adhesion between resin insulating layers and conductor layers, which can lead to degraded high-frequency signal transmission and increased risks of peeling and short circuits due to inadequate surface roughening and via conductor formation.
Innovation Solution
A method involving the formation of a resin insulating layer on a conductor layer, followed by a roughening treatment on the surface of the insulating layer to create a desirable surface roughness, forming openings to expose the conductor layer, and subsequently building a second conductor layer with improved adhesion and reduced risk of short circuits through controlled via conductor formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a roughening treatment is applied on the surface of the resin insulating layer, then adhesion between the resin insulating layer and the second conductor layer is improved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The roughening treatment is performed in advance on the surface of the resin insulating layer before forming the openings and depositing the second conductor layer. This preliminary action ensures that the surface is properly prepared for adhesion before subsequent processing steps, resolving the contradiction by establishing the adhesion-enhancing surface structure early in the manufacturing sequence.
2Strength
If the surface of the resin insulating layer is roughened, then adhesion is enhanced, but the risk of peeling and short circuits increases due to inadequate control of surface roughness and gap dimensions
Solution Approach 1:
The invention specifies controlled parameters for the roughening treatment, including surface roughness within the range of 0.5 μm to 5 μm and gap dimensions between 1 μm to 10 μm. By defining and controlling these critical parameters, the invention optimizes adhesion while preventing excessive roughness that could lead to peeling and short circuits, thus resolving the contradiction between enhanced adhesion and reduced defect risk.
Solution Approach 2:
The invention incorporates control mechanisms to monitor and adjust the roughening treatment process, ensuring that surface roughness and gap dimensions remain within specified ranges. This feedback control prevents over-roughening that could cause reliability issues while maintaining sufficient adhesion, thereby resolving the contradiction between strength enhancement and reliability maintenance.
3Strength
If openings are formed after roughening treatment, then via conductors can be properly formed with good adhesion, but the manufacturing precision requirements increase
Solution Approach 1:
The roughening treatment is performed before forming the openings, preparing the surface in advance. This preliminary action ensures that when openings are subsequently formed, the surrounding surface already has optimal adhesion properties, allowing via conductors to bond effectively to the roughened surface. This sequencing resolves the contradiction by establishing adhesion conditions before the precision-critical opening formation step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances adhesion between the resin insulating and conductor layers, improves high-frequency signal transmission, and reduces the risk of defects like peeling and short circuits by maintaining a controlled surface roughness and gap dimensions, resulting in a reliable wiring substrate.
Implementation Method 1
applying a roughening treatment on a surface of the resin insulating layer
Data Source
AI summary
A method for manufacturing a wiring substrate includes forming a resin insulating layer on a first conductor layer such that the resin insulating layer covers the first conductor layer, applying a roughening treatment on a surface of the resin insulating layer on the opposite side with respect to the first conductor layer, forming an opening in the resin insulating layer after the roughening treatment on the surface of the resin insulating layer such that the opening penetrates through the resin insulating layer and exposes a portion of the first conductor layer, and forming a second conductor layer on the surface of the resin insulating layer such that the second conductor layer is formed in contact with the surface of the resin insulating layer and that a via conductor is formed in the opening of the resin insulating layer.