Wiring Substrate Sealing with Suction Holding
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices are inefficient in maximizing the number of products obtained from a single wiring substrate, as they require a significant outer frame region for alignment, which limits the area available for the semiconductor chip and reduces manufacturing efficiency.
Innovation Solution
A method is introduced where the wiring substrate is sealed using a resin that covers the semiconductor chip, the first main surface, and the side surfaces, with a suctioning mechanism using adsorption holes to hold the substrate, allowing for a smaller outer frame region and increased substrate utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a large outer frame region is provided for alignment during manufacturing, then alignment precision is improved, but the area available for semiconductor chips is reduced, decreasing productivity
Solution Approach 1:
The patent replaces traditional mechanical alignment methods (using physical outer frame regions and alignment marks) with a suction-based holding system. The suction holes create negative pressure to hold the wiring substrate in position during sealing, eliminating the need for large mechanical outer frame structures. This substitution allows the outer frame region to be minimized while maintaining alignment precision through suction force rather than mechanical constraints.
Solution Approach 2:
The patent employs pneumatic principles by using suction holes that apply negative pressure to hold the wiring substrate during the sealing process. This pneumatic holding mechanism replaces traditional mechanical alignment fixtures, allowing precise positioning without requiring large outer frame regions. The suction force provides sufficient holding power to maintain alignment precision while enabling compact substrate design that maximizes chip area.
2Productivity
If the outer frame region is minimized to increase substrate utilization, then productivity is improved, but alignment precision during manufacturing may deteriorate
Solution Approach 1:
The patent replaces mechanical alignment fixtures that require large outer frame regions with a suction-based holding system. The suction holes create negative pressure to hold the wiring substrate in position during sealing, providing sufficient alignment precision without requiring large mechanical constraints. This allows the outer frame region to be minimized to maximize substrate utilization while maintaining manufacturing precision through pneumatic holding.
Solution Approach 2:
The patent changes the holding mechanism from mechanical (relying on physical frame structures) to pneumatic (using suction pressure). By adjusting the suction pressure parameter, the system can maintain alignment precision even with minimized outer frame regions. The suction force provides controllable holding power that adapts to the reduced frame size, ensuring alignment precision is maintained while maximizing substrate area for chips.
3Device complexity
If traditional sealing methods are used without suction holding, then device complexity is reduced, but manufacturing efficiency and substrate utilization are decreased due to larger outer frame requirements
Solution Approach 1:
The patent integrates multiple functions into the suction holding mechanism. The suction holes not only hold the wiring substrate in position during sealing but also provide alignment functionality and enable compact substrate design. This multi-functional approach achieves manufacturing efficiency and substrate optimization without significantly increasing overall process complexity, as the suction system serves multiple purposes simultaneously.
Solution Approach 2:
The patent introduces pneumatic principles through suction holes that provide holding and alignment functions during sealing. While this adds a pneumatic system, the complexity increase is offset by the elimination of large mechanical outer frame structures and alignment fixtures. The pneumatic system provides a more efficient overall process by enabling compact substrate design and improved manufacturing efficiency with integrated holding and alignment capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency by allowing more semiconductor devices to be produced from a single wiring substrate, as the smaller outer frame region minimizes waste and optimizes the use of substrate area, thereby improving overall production efficiency.
Implementation Method 1
suctioning the second main surface of the wiring substrate with a plurality of adsorption holes, whereby the first type holds the wiring substrate
Data Source
AI summary
An object of the present invention is to improve manufacturing efficiency of a semiconductor device. The method of manufacturing a semiconductor device includes a sealing step of sealing a semiconductor chip mounted on the wiring substrate. The sealing step includes a step of arranging the wiring substrate between an upper mold and a lower mold, suctioning a lower surface of the wiring substrate with the plurality of suction holes, thereby holding the wiring substrate the upper mold, and a step of sealing the semiconductor chip, an upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate such that each of the semiconductor chip, the upper surface of the wiring substrate, and the plurality of side surfaces of the wiring substrate is covered with the resin in the lower mold.