Wiring Substrate Segmented Cavity for Component Positioning
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Solution Overview
Problem
Existing wiring boards with multiple electronic components in a single cavity face risks of displacement during insulating layer filling, leading to potential short-circuiting and connection failures, affecting electrical reliability.
Innovation Solution
A wiring substrate design featuring a core layer with penetrating holes and projecting parts to securely hold multiple electronic components in place, supported by a resin layer, which prevents physical contact and ensures proper connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple electronic components are disposed in a single cavity, then the productivity and space utilization are improved, but the reliability deteriorates due to displacement risks during insulating layer filling
Solution Approach 1:
The cavity is segmented into multiple independent component receiving spaces by partition walls. Each space can independently hold one or more electronic components, preventing displacement during insulating layer filling while maintaining high space utilization. The partition walls create physical separation that isolates components from each other during the filling process.
Solution Approach 2:
Protrusions are formed on the partition walls before filling the cavity with insulating layer. These protrusions engage with grooves on the electronic components, securing them in position before the filling process begins. This preliminary positioning action prevents displacement during subsequent insulating layer injection.
2Productivity
If electronic components are closely arranged in a cavity, then the productivity is improved, but the manufacturing precision deteriorates due to displacement during filling
Solution Approach 1:
The cavity is divided into multiple component receiving spaces by partition walls, allowing dense arrangement of components while maintaining precise positioning. Each segmented space contains one or more components with dedicated protrusion-groove engagement structures, preventing displacement even at high component densities.
Solution Approach 2:
Protrusions on partition walls and grooves on components are formed in advance to establish precise positioning. This preliminary engagement structure ensures that components maintain accurate positions during the filling process, enabling high manufacturing precision even when components are closely arranged.
3Device complexity
If a single cavity is used for multiple components, then the device complexity is reduced, but the reliability worsens due to potential short-circuiting from displacement
Solution Approach 1:
The single cavity is internally segmented into multiple component receiving spaces by partition walls, maintaining the simplicity of a single external cavity structure while creating internal separation. This segmentation prevents physical contact and short-circuiting between components, preserving electrical reliability without increasing external device complexity.
Solution Approach 2:
Protrusions and grooves are formed in advance on partition walls and components respectively, creating engagement structures that prevent displacement. This preliminary positioning action ensures components remain electrically isolated during filling, maintaining reliability while keeping the overall cavity structure simple.
Data Source
AI summary
A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part, and a resin layer filling the hole and supporting the electronic components.