Wiring Substrate With Segmented Glass Cores For Variable Via Diameters
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing density of wiring lines and electrode pads on multi-layer wiring substrates due to advanced electronic components poses challenges in forming wiring lines on substrates with a predetermined number of layers, and using glass as a core substrate complicates the formation of through electrodes with different diameters.
Innovation Solution
A wiring substrate configuration featuring a core substrate with first and second glass substrates of different diameters, separated by an insulating member, allowing for the formation of through electrodes with varying diameters and pitches to accommodate diverse electronic components, and a method involving photolithography, crystallization, and electrolytic plating to manufacture these substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass is used as the core substrate material, then warpage due to thermal expansion is reduced, but it becomes difficult to form through electrodes having different diameters in the same core substrate
Solution Approach 1:
The core substrate is divided into multiple separate glass substrates, each with through electrodes of uniform diameter. These segmented substrates are then combined to achieve the overall function of handling multiple signal types with different electrode diameter requirements, thus maintaining the ease of through electrode formation while addressing the need for varied diameters.
Solution Approach 2:
Multiple glass substrates with through electrodes of different diameters are arranged and combined within a single wiring substrate structure. This nesting approach allows the wiring substrate to accommodate both small-diameter and large-diameter through electrodes by integrating multiple uniform glass substrate units, thereby resolving the contradiction between material stability and manufacturing ease.
2Adaptability or versatility
If the number of wiring lines and electrode pads is increased to accommodate more integrated elements, then signal processing capability is improved, but it becomes impossible to form wiring lines on the wiring substrate having a predetermined number of layers
Solution Approach 1:
Through electrodes of different diameters are selectively positioned in different regions of the wiring substrate to match the local requirements of mounted electronic components. High-density small-diameter through electrodes are used in regions requiring fine-pitch connections, while large-diameter through electrodes are used in regions requiring robust connections, thereby increasing signal processing capability without uniformly increasing overall substrate complexity.
Solution Approach 2:
The patent introduces dimensional variation in through electrode diameter as an additional degree of freedom beyond the traditional layer structure. By varying the diameter dimension of through electrodes while maintaining a predetermined number of wiring layers, the substrate can accommodate higher component density and more integrated elements without increasing layer complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable connection of electronic components with varying pitches and diameters, reduces internal stress and warpage, and facilitates efficient manufacturing by allowing for adjustable positioning and improved adhesion of insulating layers.
Implementation Method 1
a method involving photolithography, crystallization, and electrolytic plating to manufacture these substrates
Implementation Method 2
a method involving photolithography, crystallization, and electrolytic plating to manufacture these substrates
Implementation Method 3
a method involving photolithography, crystallization, and electrolytic plating to manufacture these substrates
Data Source
AI summary
There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top.