Wiring Substrate Segmented Protection Patterns
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Solution Overview
Problem
The challenge in the electronic industry is to create a wiring substrate with fine circuitry, excellent electrical properties, high functionality, and increased reliability while reducing process defects, particularly for portable devices that require compact size and high-speed performance.
Innovation Solution
A wiring substrate is fabricated with a dielectric layer having unit regions, a sawing region, and an edge region, featuring a first upper protection pattern on the unit and sawing regions and a second upper protection pattern on the edge region, made of different dielectric materials. This design includes forming a molding layer around semiconductor chips and cutting the substrate along the sawing region to separate the units, using a method that involves a panel substrate with a cutting region and forming protection patterns to facilitate separation and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single upper protection pattern is formed on the entire surface including edge regions, then the fabrication process is simple, but the molding process causes adhesion defects and reliability issues
Solution Approach 1:
The upper protection pattern is divided into two distinct segments: a first upper protection pattern formed on unit regions and a second upper protection pattern formed on edge regions. This segmentation allows each region to have optimized properties for its specific function, preventing adhesion defects during molding while maintaining overall structural integrity.
Solution Approach 2:
Different dielectric materials are used for the first and second upper protection patterns based on their specific location and function. The first pattern uses material optimized for electrical insulation on unit regions, while the second pattern uses material with appropriate adhesion characteristics for edge regions during molding, achieving local optimization of material properties.
2Reliability
If the wiring substrate is designed with fine circuitry for high functionality, then electrical performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The first and second upper protection patterns are formed as preliminary protective structures before final circuit fabrication and molding steps. These patterns pre-establish proper surface conditions and adhesion characteristics, preventing defects that would otherwise require rework or cause manufacturing failures during subsequent high-precision operations.
Data Source
AI summary
Disclosed are wiring substrates, methods of fabricating the same, and methods of fabricating semiconductor packages. The wiring substrate includes a dielectric layer that includes a plurality of unit regions, a sawing region that surrounds each of the unit regions, and an edge region that surrounds the unit regions and the sawing region, a first upper protection pattern on a top surface of the dielectric layer on the unit regions and the sawing region, and a second upper protection pattern on a top surface of the dielectric layer on the edge region. The second upper protection pattern surrounds the first upper protection pattern when viewed in plan and includes a dielectric material different from a dielectric material of the first upper protection pattern.