Wiring Substrate Side-Surface Routing for Simpler Backplane Fabrication
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Solution Overview
Problem
The manufacturing process of backplanes for Mini LED and Micro LED display devices is complicated, leading to low process yield and high costs due to the need for designing and fabricating wiring on both surfaces of the substrate, which can result in scratching and reliability issues.
Innovation Solution
A wiring substrate design with connection lines extending from one main surface to the other through a set side surface, formed in a single film forming process, ensuring a one-piece structure and reducing the need for dual-surface wiring, thereby improving reliability and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring is designed and fabricated on both surfaces of the substrate, then electrical connection is achieved, but the manufacturing process becomes complicated and reliability decreases
Solution Approach 1:
The connection line transitions from a two-dimensional planar structure to a three-dimensional structure by extending through the thickness direction of the substrate. The connection line includes a first section on the first main surface, a second section penetrating through the substrate thickness, and a third section on the second main surface, forming a continuous 3D conductive path that eliminates the need for separate wiring layers on both surfaces.
Solution Approach 2:
The invention merges the wiring functions of both substrate surfaces into a single integrated connection line structure. The connection line simultaneously serves as the conductive path on the first main surface, through the substrate, and on the second main surface, consolidating what would traditionally require separate wiring layers into one unified structure.
2Productivity
If wiring is designed and fabricated on both surfaces of the substrate, then electrical connection is achieved, but process yield decreases due to scratching and reliability issues
Solution Approach 1:
The connection line extends into the thickness dimension of the substrate, creating a 3D conductive path that penetrates through the substrate. This vertical extension reduces the need for extensive planar wiring on both surfaces, minimizing the area exposed to potential scratching during handling and manufacturing processes.
3Reliability
If connection lines have larger area at the first surface than at the second surface, then electrical connection is improved, but material usage increases
Solution Approach 1:
The connection line exhibits non-uniform cross-sectional area along its length, with the first section having a larger area at the first main surface and the third section having a smaller area at the second main surface. This variable cross-section optimizes electrical connection reliability at each surface while minimizing the total volume of conductive material required.
Data Source
AI summary
A wiring substrate includes a substrate and a plurality of connection lines located on the substrate. The substrate includes a first main surface and a second main surface arranged opposite to each other in a thickness direction of the substrate, and side surfaces between the first main surface and the second main surface. The side surfaces include a set side surface. The connection lines extend from the first main surface to the second main surface through the set side surface. Any one of the plurality of connection lines includes: a first surface and a second surface arranged opposite to each other. The first surface is closer to the substrate than the second surface, and an area of the first surface is greater than an area of the second surface.