Wiring Substrate Support Member Segmentation for Rigidity

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Solution Overview

Problem

Thin wiring substrates with multiple layers face challenges in rigidity and warping due to their low thickness, and conventional support members are not optimized, leading to unnecessary thickness and potential warping issues.

Innovation Solution

A wiring substrate with a support member composed of alternately layered metal foils and resin layers, where the number of metal foil layers matches the number of wiring layers, providing enhanced rigidity and preventing warping by ensuring a balanced thickness and symmetrical layered structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the thickness of the wiring substrate is reduced to less than 100 μm, then the wiring substrate achieves thinner profile and better integration, but the rigidity of the substrate decreases making it difficult to handle during manufacturing

Engineering Contradiction:

Improvethickness of wiring substrateVSAvoidrigidity of substrate

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The support member is segmented into multiple metal foil layers (first metal foil, second metal foil, third metal foil) separated by resin layers, creating a laminated structure. This segmentation allows each layer to contribute to overall rigidity while maintaining thin individual layer thicknesses, solving the contradiction between thin overall thickness and sufficient rigidity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support member uses composite materials consisting of multiple metal foils (copper, aluminum, or copper alloy) combined with resin layers. This composite structure provides enhanced rigidity and mechanical strength while maintaining thin overall thickness, directly addressing the contradiction between reduced thickness and maintained rigidity.

Inventive Principle:

Principle #40Composite materials

2Strength

If a conventional support member structure is used, then the substrate achieves sufficient rigidity, but the support member becomes thicker than required and may cause warping

Engineering Contradiction:

Improverigidity of support memberVSAvoidthickness of support member

Core Design Contradiction:

StrengthVSLength of moving object

Solution Approach 1:

Different metal foil layers have different local properties: the first metal foil has high rigidity for structural support, while the second and third metal foils have lower rigidity and are designed for peeling removal. This local quality differentiation allows the support member to achieve necessary rigidity with thinner overall thickness, preventing warping while maintaining handling ease.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention changes the rigidity parameter of metal foils at different positions within the support member. The first metal foil maintains high rigidity for structural integrity, while the second and third metal foils use lower rigidity materials that facilitate peeling. This parameter variation enables thin support member design without warping issues.

Inventive Principle:

Principle #35Parameter changes

3Strength

If multiple metal foil layers are used in the support member, then the rigidity is enhanced, but the manufacturing complexity increases

Engineering Contradiction:

Improverigidity of support memberVSAvoidlayer structure of support member

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The second and third metal foils are preliminarily attached to the first metal foil with peeling capability, allowing the multi-layer structure to be assembled in advance as an integrated unit. This preliminary action simplifies the manufacturing process by reducing the number of separate assembly steps required, despite the increased layer complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Resin layers serve as intermediaries between the metal foil layers, providing adhesion and structural integration. The resin layers simplify the manufacturing process by enabling simultaneous handling of multiple metal foil layers as a unified structure, reducing the complexity associated with managing multiple separate layers.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS9997441B2Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package

Publication Date: 2018.06.12 SHINKO ELECTRIC IND CO LTD

AI summary

A wiring substrate includes a support member, and a wiring member formed on one side of the support member. The support member includes metal foils and at least one resin layer alternately layered, so that one of the metal foils is provided as a first outermost layer on the one side of the support member and another one of the metal foils is provided as a second outermost layer on another side of the support member. The first outermost layer includes thick and thin foils that are peelably adhered. The thick foil contacts the at least one resin layer. One surface of the thin foil faces an outer side of the support member. The wiring member includes wiring layers and an insulating layer alternately layered on the thin foil. The number of the metal foils and the number of the wiring layers are the same.