Wiring Substrate with Perpendicular Connection Terminal and Heat Radiation
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Solution Overview
Problem
Existing wiring substrates face challenges in achieving high heat radiation and miniaturization due to insufficient heat dissipation and increased size or height from connection terminals, which hinder high-density mounting and device miniaturization.
Innovation Solution
A wiring substrate with a high thermal conductive layer and integrally formed heat radiation piece on the connection terminal, allowing for enhanced heat dissipation through both the substrate and connection terminal, while also reducing substrate size and height by bending the connection terminal perpendicular to the surface and forming it in an arc shape, and incorporating features like concave sections and window sections for improved ventilation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection terminals are installed on the mounting surface, then electrical connection is achieved, but the substrate size must be enlarged to accommodate the terminals
Solution Approach 1:
The connection terminal is bent perpendicular to the mounting surface, transitioning from a planar arrangement to a three-dimensional configuration. This allows the terminal to extend vertically from the substrate surface rather than occupying horizontal mounting space, thereby reducing the substrate area required while maintaining connection functionality
2Reliability
If connectors are disposed on the mounting surface, then connection functionality is achieved, but the substrate height increases
Solution Approach 1:
Instead of placing the connector on top of the mounting surface (conventional approach), the connector is inverted to be disposed inside a recess formed in the substrate. This inversion allows the connector to be nested within the substrate volume rather than adding to its external height, achieving connection functionality without increasing overall substrate height
3Quantity of substance
If high density mounting is achieved by installing substrates in parallel, then mounting density increases, but heat radiation becomes insufficient
Solution Approach 1:
The heat radiation function is segmented from the substrate body and assigned to a dedicated heat radiation piece attached to the connection terminal. This segmentation allows the heat radiation piece to be positioned optimally for heat dissipation (extending from the terminal) while the substrate maintains high-density mounting capability, thereby resolving the conflict between mounting density and heat radiation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves effective heat radiation and reliable connection reliability, enabling high-density mounting while maintaining a compact size and preventing connection terminal deterioration from heat, thus enhancing the substrate's heat management and structural integrity.
Implementation Method 1
a substrate which has a high thermal conductive layer in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components
Implementation Method 2
a heat radiation piece section which is integrally installed to the connection terminal
Data Source
AI summary
Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.