Wiring Substrate Thin Dielectric Layer Manufacturing
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Solution Overview
Problem
Thinning the dielectric layer in multilayer wiring substrates is challenging due to the thickness of glass fibers and surface roughness of wiring layers, which affects insulation and electrostatic capacitance.
Innovation Solution
A laminated sheet structure with a thin inorganic dielectric layer sandwiched between conductor layers, where the second conductor layer is made of nickel with a smooth surface and the dielectric layer is formed using barium titanate or other materials, allowing for a thickness of approximately 0.5 μm to 2 μm, and the use of a sputtering method to prevent electrical short-circuiting and layer breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a prepreg with glass fiber is used for the dielectric layer, then the mechanical strength and insulation are improved, but the thickness cannot be reduced below the glass fiber thickness (30 μm or more)
Solution Approach 1:
The invention extracts the glass fiber reinforcement function from the dielectric layer by placing a separate reinforcing layer (prepreg with glass fiber) below the thin dielectric layer. This allows the dielectric layer itself to be made very thin (3 μm or less) while the reinforcing layer provides the necessary mechanical strength and insulation support.
Solution Approach 2:
The invention changes the structural arrangement by stacking the thin dielectric layer on top of the reinforcing layer, creating a multi-layer configuration where each layer serves a specific function. This dimensional arrangement allows the dielectric layer thickness to be reduced without compromising overall structural integrity.
2Quantity of substance
If the dielectric layer is thinned to increase electrostatic capacitance, then the capacitance increases, but the surface roughness of the wiring layer causes insulation failure
Solution Approach 1:
The invention applies a flattening layer between the rough wiring layer and the thin dielectric layer to compensate for surface roughness in advance. This flattening layer acts as a cushion that prevents the dielectric layer from being punctured by surface irregularities, ensuring reliable insulation even when the dielectric layer is extremely thin (3 μm or less).
3Quantity of substance
If the dielectric layer is made thinner than 10 μm, then the electrostatic capacitance increases, but the risk of electrical short-circuit and layer breakage increases due to surface roughness
Solution Approach 1:
The invention introduces a flattening layer as an intermediary between the rough wiring layer and the thin dielectric layer. This mediator layer protects the fragile thin dielectric layer from damage caused by surface roughness, enabling the use of extremely thin dielectric layers (3 μm or less) without increasing the risk of short-circuits or breakage.
Solution Approach 2:
The invention creates a composite structure consisting of multiple layers (wiring layer, flattening layer, dielectric layer, reinforcing layer) where each material is selected for its specific properties. This composite approach allows the dielectric layer to be made extremely thin while the other layers provide protective and supportive functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of a thin dielectric layer that increases electrostatic capacitance while maintaining the integrity of the conductor layers, facilitating the manufacturing of thinner, more efficient wiring substrates with improved insulation and reduced risk of electrical short-circuits.
Implementation Method 1
the use of a sputtering method to prevent electrical short-circuiting and layer breakage
Data Source
AI summary
A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.