Wiring Substrate With Through Hole Projections
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Solution Overview
Problem
The existing manufacturing process for wiring substrates often results in residual adhesive agent from temporary tapes causing warping or delamination of the insulation layer, leading to defective substrates due to rigid pressure application during insulation layer formation.
Innovation Solution
A wiring substrate design featuring projections on the inner walls of through holes that support electronic components with resin covers, eliminating the need for temporary tapes and preventing adhesive residue, while ensuring secure engagement and reduced stress on the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a tape is temporarily fastened to the core substrate to seal the through hole during insulation layer formation, then the electronic component can be held in position, but the adhesive agent of the tape remains on the core substrate causing warping or defoliation
Solution Approach 1:
The invention extracts and removes the problematic tape sealing method entirely. Instead of using a tape that leaves adhesive residue, the patent employs a mold with a through hole that directly receives and secures the electronic component during insulation layer formation. The mold is removed after curing, leaving no residual adhesive on the core substrate, thus eliminating the cause of warping and defoliation while maintaining positioning accuracy.
Solution Approach 2:
The invention introduces a mold as an intermediary tool between the electronic component and the core substrate. The mold temporarily holds the electronic component in the through hole during insulation layer formation and is then removed. This intermediary approach allows for secure positioning without using adhesive tapes that would leave harmful residues on the substrate.
2Manufacturing precision
If pressure is applied to form the insulation layer with tape fastened, then the insulation layer is properly formed, but the tape becomes rigidly fastened making removal difficult
Solution Approach 1:
The invention extracts the tape from the process entirely and replaces it with a mold-based system. The mold allows pressure to be applied uniformly during insulation layer formation without creating rigid adhesion to the core substrate. After the insulation layer is formed, the mold is simply removed, eliminating the difficulty of tape removal while maintaining insulation layer quality.
Solution Approach 2:
The mold is designed and positioned beforehand to receive the electronic component and allow insulation layer formation. The mold structure is prepared in advance to facilitate easy removal after curing, preventing the rigid fastening problem that occurs with adhesive tapes during the pressing process.
3Ease of operation
If the through hole is larger than the electronic component, then the electronic component can be fitted into the through hole, but the component may move or rotate during insulation layer formation
Solution Approach 1:
The mold includes localized engagement structures such as ribs or protrusions that fit into corresponding grooves or recesses on the electronic component. These local engagement features prevent movement and rotation of the component during insulation layer formation while still allowing easy insertion. The engagement structures are positioned specifically to provide stability without interfering with the overall fitting process.
Solution Approach 2:
The through hole in the mold and the electronic component feature asymmetric engagement structures, such as a rib in the mold fitting into a groove on the component. This asymmetric design prevents rotation and ensures proper orientation of the component during insulation layer formation, while still allowing straightforward insertion in the correct direction.
Data Source
AI summary
A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover of the electronic component. An insulator is filled between the inner wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The resin cover of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.