Wiring Substrate With Variable Conductor Thickness For Impedance Control
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Solution Overview
Problem
Existing wiring substrates face challenges in achieving multiple wiring patterns with different characteristic impedances within the same conductor layer, limiting the flexibility and efficiency of signal transmission.
Innovation Solution
The wiring substrate incorporates a core substrate with build-up parts featuring alternately laminated insulating and conductor layers, including a first wiring with a larger conductor thickness and a second wiring with a smaller thickness, allowing for varying line widths and spaces to adjust the characteristic impedance of each signal path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single conductor thickness is used for all wiring layers, then manufacturing is simplified, but the ability to achieve multiple wiring patterns with different characteristic impedances is limited
Solution Approach 1:
The patent applies local quality by making the conductor thickness vary within different regions of the same conductor layer. Specifically, the conductor layer includes a first region with a first thickness and a second region with a second thickness different from the first. This allows different wiring patterns within the same layer to have different characteristic impedances, enabling multi-purpose wiring without increasing the number of layers.
Solution Approach 2:
The patent changes the physical parameter of conductor thickness within the same conductor layer to achieve different electrical characteristics. By varying the thickness parameter locally, the patent enables different wiring patterns to have different characteristic impedances, solving the limitation of uniform thickness designs.
2Reliability
If uniform conductor thickness is maintained across all wiring layers, then manufacturing precision is easier to control, but signal transmission quality for different signal types cannot be optimized
Solution Approach 1:
The patent implements local quality by creating regions with different conductor thicknesses within the same conductor layer. The first region has a first thickness optimized for certain signal types, while the second region has a second thickness optimized for other signal types. This allows signal transmission quality to be optimized for different wiring patterns without requiring multiple layers.
3Adaptability or versatility
If multiple wiring layers with different thicknesses are created using traditional build-up methods, then different characteristic impedances can be achieved, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges the functions of multiple conductor layers with different thicknesses into a single conductor layer. By forming different thickness regions within one layer during a single manufacturing process, the patent achieves wiring pattern diversity without increasing the number of lamination and etching steps required in traditional multi-layer build-up methods.
Solution Approach 2:
The patent transitions from varying thickness across multiple layers (vertical dimension) to varying thickness within a single layer (horizontal dimension). This dimensional change allows different characteristic impedances to be achieved within the same layer, reducing the number of manufacturing steps while maintaining wiring pattern diversity.
Data Source
AI summary
A wiring substrate includes a core substrate, and a build-up part formed on the core substrate and including insulating layers and conductor layers. The conductor layers include one or more conductor layers each having a first wiring and a second wiring such that the second wiring has a conductor thickness smaller than a conductor thickness of the first wiring and that a minimum value of a line width of a wiring pattern of the second wiring is smaller than a minimum value of a line width of a wiring pattern of the first wiring.