Wiring Substrate With Multi-Layer Vertical Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring substrates have limited flexibility in designing wirings between electronic components, as they often lack efficient electrical connections between different surfaces, restricting the degree of freedom in circuit design.
Innovation Solution
A wiring substrate is designed with a first insulating layer, a conductor layer featuring first and second conductor pads, a second insulating layer with openings exposing the second conductor pads, and a wiring structure within these openings. The wiring structure includes a resin insulating layer and a wiring layer, with connection pads on both surfaces that are electrically connected via conductors, allowing for component mounting on one surface and electrical connection to the other surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional wiring substrate structure is used, then the structure is simple, but the flexibility in wiring design between electronic components is limited
Solution Approach 1:
The wiring substrate is divided into multiple insulating layers (first insulating layer, second insulating layer, third insulating layer) with conductor layers and wiring structures at different levels. This segmentation allows independent routing of signals on different layers, enabling flexible wiring design while maintaining manageable structural complexity through modular organization.
Solution Approach 2:
The patent introduces a multi-layer vertical structure with conductor layers, wiring structures, and insulating layers stacked in the thickness direction. This adds the vertical dimension to wiring design, allowing connections between different surfaces and regions through via holes and conductors that penetrate through insulating layers, significantly increasing wiring flexibility beyond planar limitations.
2Adaptability or versatility
If electrical connections between different surfaces are lacking, then the structure is simple, but the degree of freedom in circuit design is restricted
Solution Approach 1:
Via holes and conductors serve as intermediary elements that electrically connect conductor pads on different surfaces and wiring structures at different levels. These intermediaries enable complex three-dimensional circuit routing by bridging gaps between layers, allowing design freedom without requiring all connections to be made on single planes.
Solution Approach 2:
The wiring structure embeds conductors within insulating layers, with wiring structures nested between the first and third insulating layers. This nesting arrangement allows multiple functional elements (conductor pads, via holes, wiring structures) to be integrated in a compact vertical configuration, achieving high connectivity while controlling overall structural complexity.
Data Source
AI summary
A wiring substrate includes a first insulating layer, a conductor layer including first and second conductor pads, a second insulating layer having an opening exposing the second conductor pads, and a wiring structure including a resin insulating layer and a wiring layer and formed in the opening of the second insulating layer. The wiring structure has first surface side connection pads, second surface side connection pads and electrically connected to the second conductor pads of the conductor layer, and conductors that electrically connect the first surface side connection pads and the second surface side connection pads, the first surface side connection pads form a component mounting surface having first and second component mounting region, and the first surface side connection pads include a group of pads in the first region and a group of pads in the second region electrically connected to the group of pads in the first region.