Wiring Substrate With Varying Via Diameters For Impedance Stability
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Solution Overview
Problem
Existing wiring substrates face challenges in achieving a stable characteristic impedance and accommodating complex wiring circuits due to limitations in via conductor dimensions and layer configurations.
Innovation Solution
A wiring substrate is designed with multiple build-up parts, each featuring via conductors of different diameters and multiple insulating and conductor layers, allowing for a stable characteristic impedance and complex wiring structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If via conductors of the same diameter are used across all build-up parts, then manufacturing is simplified, but characteristic impedance becomes unstable and complex wiring circuits cannot be accommodated
Solution Approach 1:
The patent applies local quality by assigning different diameters to via conductors in different build-up parts. Specifically, via conductors in the first build-up part have a first diameter, while via conductors in the second build-up part have a second diameter that is larger than the first. This localized differentiation allows each build-up part to achieve optimal characteristic impedance for its specific wiring circuit requirements, thereby resolving the contradiction between manufacturing simplicity and impedance stability.
Solution Approach 2:
The patent implements parameter changes by varying the diameter parameter of via conductors across different build-up parts. The first via conductors have a first diameter and the second via conductors have a second diameter > first diameter. This parameter variation enables precise control over characteristic impedance in each layer, allowing stable impedance throughout the multi-layer structure while accommodating complex wiring circuits.
2Ease of manufacture
If via conductors of the same diameter are used across all build-up parts, then manufacturing processes are simplified, but the ability to accommodate complex wiring circuits is limited
Solution Approach 1:
The patent applies local quality by assigning different diameters to via conductors in different build-up parts. Specifically, via conductors in the first build-up part have a first diameter, while via conductors in the second build-up part have a second diameter that is larger than the first. This localized differentiation allows each build-up part to achieve optimal characteristic impedance for its specific wiring circuit requirements, thereby resolving the contradiction between manufacturing simplicity and impedance stability.
Solution Approach 2:
The patent implements parameter changes by varying the diameter parameter of via conductors across different build-up parts. The first via conductors have a first diameter and the second via conductors have a second diameter > first diameter. This parameter variation enables precise control over characteristic impedance in each layer, allowing stable impedance throughout the multi-layer structure while accommodating complex wiring circuits.
3Adaptability or versatility
If via conductors of different diameters are used in different build-up parts, then characteristic impedance becomes unstable, but wiring circuit flexibility increases
Solution Approach 1:
The patent applies local quality by assigning different diameters to via conductors in different build-up parts. Specifically, via conductors in the first build-up part have a first diameter, while via conductors in the second build-up part have a second diameter that is larger than the first. This localized differentiation allows each build-up part to achieve optimal characteristic impedance for its specific wiring circuit requirements, thereby resolving the contradiction between manufacturing simplicity and impedance stability.
Solution Approach 2:
The patent implements parameter changes by varying the diameter parameter of via conductors across different build-up parts. The first via conductors have a first diameter and the second via conductors have a second diameter > first diameter. This parameter variation enables precise control over characteristic impedance in each layer, allowing stable impedance throughout the multi-layer structure while accommodating complex wiring circuits.
Data Source
AI summary
A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.