Redistribution Wiring Support Pattern for Ball Land Stability

The patent applies local quality by creating a support pattern with a wider width specifically in the space region where wiring lines lack substrate support. This localized structural enhancement provides additional mechanical strength exactly where needed, while maintaining the overall high wiring density design. The support pattern's increased width (greater than the wiring line width) creates a reinforced zone that prevents wiring damage in the previously vulnerable unsupported area.

The support pattern acts as an intermediary structural element between the thin wiring lines and the substrate. This mediator provides mechanical reinforcement to the fragile thin wiring lines without interfering with their electrical function. The support pattern's wider width creates a protective foundation that shields the thin wiring lines from external impacts and mechanical stress, allowing high wiring density to be achieved while maintaining adequate mechanical strength.

The patent segments the wiring line structure into two distinct parts: the original wiring line with its standard width for electrical connectivity, and the additional support pattern with wider width for mechanical reinforcement. This segmentation allows each component to be optimized for its specific function while being manufactured through standard photolithography processes. The support pattern is formed as a separate structural element that can be defined using conventional manufacturing techniques, avoiding the need for complex multi-step processes.