Wafer Level Burn-In Shell With Integrated Heater

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Solution Overview

Problem

Existing wafer level burn-in test machines face issues with high energy consumption and slow loading/unloading operations, which hinder efficient production processes.

Innovation Solution

Integrating a heater directly into the shell housing the wafer, allowing direct contact with the wafer for thermal testing, and using an aspiration system to secure the wafer in place, eliminating the need for external heat sources and optimizing the alignment and loading processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a cartridge-based system with external heating is used, then the wafer can be tested, but energy consumption is high due to thermal dispersion

Engineering Contradiction:

Improveenergy consumptionVSAvoidthermal dispersion

Core Design Contradiction:

Use of energy by moving objectVSLoss of energy

Solution Approach 1:

The heating element is integrated directly into the shell structure that houses the wafer, merging the heating function with the housing. This allows direct thermal contact with the wafer, eliminating thermal dispersion through air gaps and reducing energy consumption significantly compared to external heating systems.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The shell acts as an intermediary between the heating element and the wafer, providing direct thermal coupling. The heating element is positioned within the shell to ensure efficient heat transfer to the wafer while minimizing energy loss to the surrounding environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If a cartridge-based system is used, then the wafer can be tested, but loading and unloading operations are slow

Engineering Contradiction:

Improveloading speedVSAvoidloading time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The shell is designed as a separable component that can be easily removed from the test machine. This segmentation allows rapid loading and unloading of wafers without requiring complex cartridge extraction mechanisms, significantly reducing loading time and improving productivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shell incorporates movable elements such as adjustable clamps or spring-loaded holders that can quickly transition between locked and unlocked states. This dynamic design enables fast wafer insertion and removal while maintaining secure positioning during testing.

Inventive Principle:

Principle #15Dynamics

3Reliability

If the cover is rigidly constrained to the base, then the wafer is securely held, but alignment precision may be compromised

Engineering Contradiction:

Improvewafer holding securityVSAvoidwafer alignment precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The shell is divided into a base and a cover that can be assembled in a controlled manner. This segmentation allows for precise alignment features to be built into each component separately, ensuring accurate wafer positioning when the cover is constrained to the base.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The constraint mechanism between cover and base is designed with localized precision features such as precision-machined mating surfaces, alignment pins, or adjustable positioning elements. These local quality improvements ensure accurate wafer alignment while maintaining secure holding throughout the testing process.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces energy expenditure and accelerates the testing process by minimizing thermal dispersion and streamlining the loading and unloading operations, enhancing the efficiency of wafer level burn-in tests.

Implementation Method 1

the heater may be brought in direct contact with the wafer to be tested, thereby minimizing thermal dispersions

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the cover comprises an aspiration system configured to create vacuum in a volume comprised between a wafer-side surface of the heater and the wafer to be tested, so as to hold the wafer to be tested against the heater

Methodology Applied

Scientific EffectVacuum: Vacuum

Data Source

PatentUS20250093405A1Shell for wafer level burn-in (WLBI) chip test, method for loading said shell and machine for burn-in test comprising said shell

Publication Date: 2025.03.20 MICROTEST SPA

AI summary

A shell for wafer level burn-in chip test, including: a base configured to connect to a burn-in driver (BID), including a printed circuit of the base electrically connectable to the BID and a probe head provided with a plurality of probes which are intended to contact respective pads of a wafer to be tested; a cover that is at least partially separable from the base), the cover including an integrated heater; and, in a test configuration, the cover is rigidly constrained to the base with a wafer to be tested interposed between the base and the cover, the heater being configured for heating the wafer to be tested during a burn-in test.