WLCSP Target Segmentation for Smaller Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The WLCSP technology requires frequent updates and increased costs as machine stations and apparatus need to be enlarged with increasing chip size, and cracks during wafer fabrication can lead to prolonged issues in packaging, necessitating a solution for adaptable and cost-effective packaging of chips and wafers of varying sizes.
Innovation Solution
The method involves recombining smaller chips, wafer parts, or half-finished packaging targets onto larger substrates, and bonding wafer parts with circuits to second substrates, allowing for packaging on smaller WLCSP apparatus, thereby extending the apparatus's lifespan and reducing hardware update costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the WLCSP apparatus is enlarged or replaced to accommodate larger chip sizes, then the packaging capability for larger chips is improved, but the hardware update cost increases significantly
Solution Approach 1:
The patent segments the wafer into multiple smaller processable units (first wafer part, second wafer part) that can be handled by existing smaller WLCSP apparatus. By dividing the large wafer into manageable segments, the system maintains compatibility with current equipment while achieving the capability to package larger overall chip structures through subsequent bonding operations.
Solution Approach 2:
The patent combines multiple smaller wafer parts onto a substrate to create a functional equivalent of a larger chip packaging system. By merging first wafer part and second wafer part (each containing multiple chips) onto a substrate and then bonding to a carrier, the system achieves large-scale packaging capability without requiring a single large WLCSP apparatus, thus avoiding significant hardware update costs.
2Productivity
If conventional WLCSP technology is used to package wafers with cracks, then the packaging process continues, but the cracks are prolonged and defects are exacerbated
Solution Approach 1:
The patent extracts or removes the cracked portions of the wafer by segmenting the wafer into multiple parts and selectively processing only the defect-free regions. By taking out the problematic cracked areas and focusing on sound wafer portions, the system maintains packaging productivity while preventing crack propagation and ensuring product reliability.
Solution Approach 2:
The patent performs preliminary inspection and segmentation of the wafer before the packaging process, identifying and isolating cracked regions in advance. By taking preliminary action to separate defective areas from functional areas, the system prevents crack propagation during subsequent packaging operations while maintaining overall process continuity and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient packaging of larger-sized wafers on smaller WLCSP apparatus, maintaining efficiency and lowering costs, allowing enterprises to adapt to market developments without substantial apparatus updates.
Implementation Method 1
bonding a side of each of the recombination units, which is opposite to a side including a circuit, to the first substrate to form a WLCSP target
Data Source
AI summary
The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.