Wafer Level Package Optical Device with Cavity Isolation
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Solution Overview
Problem
Conventional optical devices for gesture and proximity sensing in electronic devices require large form factors due to separate packaging of light emitting diodes and sensors, leading to space constraints and susceptibility to contamination, with no effective mitigation of cross-talk between components.
Innovation Solution
Integration of multiple heterogeneous components, such as light sources and sensors, into a single compact wafer level package (WLP) with a carrier substrate having cavities and a glass cover that transmits light, using wafer level package processing techniques to reduce footprint and enhance robustness, and incorporating reflective liners and optical baffles to prevent cross-talk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate packaging of light emitting diodes and sensors is used, then ease of manufacture is improved, but device area increases and reliability deteriorates due to susceptibility to contamination
Solution Approach 1:
The patent combines multiple optical components (light emitting diodes and sensors) into a single integrated package, reducing the overall device area while maintaining manufacturing feasibility through co-packaging of heterogeneous components on a common substrate
2Ease of manufacture
If separate packaging of light emitting diodes and sensors is used, then ease of manufacture is improved, but reliability deteriorates due to susceptibility to contamination
Solution Approach 1:
The patent combines multiple optical components (light emitting diodes and sensors) into a single integrated package, reducing the overall device area while maintaining manufacturing feasibility through co-packaging of heterogeneous components on a common substrate
3Area of stationary object
If compact integration is implemented, then device area is reduced, but cross-talk between components increases
Solution Approach 1:
The patent divides the internal package structure into separate cavities that are enclosed within the common package, physically segmenting the light emitting diodes and sensors to prevent optical cross-talk while maintaining compact integration
Solution Approach 2:
The patent introduces reflective liners as intermediary elements within the cavities to manage light reflection and prevent cross-talk between adjacent components, acting as optical barriers that redirect stray light
4Area of stationary object
If compact integration is implemented, then device area is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming cavities and applying reflective liners to the substrate before final component placement and sealing, establishing precise optical paths and barriers in advance to simplify subsequent assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, robust optical device with reduced footprint, improved performance in humid and high-temperature conditions, and effective prevention of cross-talk between components, enhancing gesture and proximity sensing capabilities.
Implementation Method 1
The cover, which may be glass, is configured to transmit light within the predetermined spectrum of wavelengths
Implementation Method 2
a light source may be disposed in a first cavity of the substrate. The light source is configured to emit light in a predetermined spectrum of wavelengths
Implementation Method 3
a sensor may be disposed in a second cavity of the substrate. The sensor is configured to detect light in the predetermined spectrum of wavelengths and to provide a signal in response thereto
Data Source
AI summary
Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein. One or more optical component devices are disposed within the respective cavities in a predetermined arrangement. A cover is disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical component devices within their respective cavities. The cover, which may be glass, is configured to transmit light within the predetermined spectrum of wavelengths.