Wafer Level Package Embedded Passive Components Stabilization
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Solution Overview
Problem
Wafer level packaging faces challenges in integrating passive components due to excessive movement during the molding process, particularly in small lightweight parts, which affects yield and reliability.
Innovation Solution
The use of compression molded pillar bumping techniques in conjunction with an epoxy layer to fix electrical components at preselected locations, embedding them within a molded material with vias for accessing electrical contacts, and metalized layers for connecting these components through a conductive block, enhancing integration and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive components are integrated into wafer level packages, then component integration and functionality are improved, but manufacturing precision deteriorates due to excessive movement during molding
Solution Approach 1:
The patent applies preliminary action by pre-positioning passive components on the wafer before the molding process. The components are strategically placed and secured in advance, allowing the molding process to proceed without causing excessive movement. This advance preparation ensures that components are already in their correct positions before the molding material is applied, thereby maintaining manufacturing precision while achieving high component integration.
2Manufacturing precision
If compression molded pillar bumping techniques are used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the molding process itself. The compression molded pillar bumping technique combines component placement, encapsulation, and interconnection formation into a single integrated process. By merging these previously separate steps into one unified operation, the patent achieves high manufacturing precision without proportionally increasing overall device complexity, as the combined process is optimized to work together efficiently.
3Reliability
If passive components are embedded in molded material, then reliability is improved by reducing movement, but manufacturing precision may worsen due to molding process challenges
Solution Approach 1:
The patent applies preliminary action by pre-positioning passive components on the wafer before the molding process. The components are strategically placed and secured in advance, allowing the molding process to proceed without causing excessive movement. This advance preparation ensures that components are already in their correct positions before the molding material is applied, thereby maintaining manufacturing precision while achieving high component integration.
Solution Approach 2:
The patent uses an intermediary approach by employing a specialized molding compound that contains embedded structures or features that interact with the passive components. This intermediary molding material acts as a mediator that holds the components in place during the molding process, preventing excessive movement while allowing precise positioning to be maintained. The intermediary material bridges the gap between component placement requirements and molding process demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for greater component integration, improved electrical performance, and reduced defects by stabilizing passive components during the molding process, leading to more reliable and efficient wafer level packages.
Implementation Method 1
an epoxy layer to fix electrical components at preselected locations
Implementation Method 2
compression molded pillar bumping techniques
Data Source
AI summary
A wafer level package includes an epoxy layer formed on an adhesive covered substrate during manufacturing for securing electrical components in place prior to being embedded in a molded material. An electrically conductive block is fixed in the epoxy layer. Vias are formed for accessing face up component contacts using a metalized layer on the surface of the molded material. After stripping the adhesive and substrate, the epoxy layer is penetrated to expose electrical contacts for face down components. An electrical connection is made between the face up and face down components using the block. Optionally, a dielectric layer covers the molded material and a second metalized layer placed on the dielectric layer to carry another electrical component embedded in a second dielectric layer covering the first dielectric layer. Thus a stacked component arrangement including multiple die and passive components is effectively fabricated into the wafer level package.