WLP RF Front-End Module With Self-Biased Magnetic Disc Integration
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Solution Overview
Problem
Existing methods for integrating magnetic functions in radio frequency transmission front-end modules face challenges such as high manufacturing costs, degradation of ferromagnetic properties, limited thickness of magnetic materials, and unsatisfactory thermal dissipation, particularly when using III-V substrates or dielectric materials.
Innovation Solution
A radio frequency transmission front-end module is developed with a self-biased magnetic material disc integrated using a Wafer Level Packaging method, where a redistribution layer connects the disc and integrated circuit through dielectric materials, eliminating the need for external magnets and adhesive, and allowing flexible thickness and form factor optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If magnetic material is deposited in a cavity formed in a semiconductive substrate using centrifugation, then the integration is compatible with CMOS manufacturing methods, but the thickness of the magnetic material is limited which restricts power handling and frequency of use
Solution Approach 1:
The patent transitions from planar deposition within a cavity to three-dimensional integration by placing the magnetic material disc on the front side of the substrate and routing connections through vias. This dimensional change allows the magnetic material to achieve greater effective thickness for enhanced power handling and frequency performance while maintaining CMOS manufacturing compatibility through standard via and metallization processes.
2Stability of the object's composition
If a cavity is etched wider than the magnetic material and filled with non-conductive epoxy resin to stabilize the magnetic disc, then mechanical stability is improved, but the substrate space is wasted and manufacturing complexity increases
Solution Approach 1:
The patent extracts the magnetic material from the cavity deposition approach and places it as a separate disc component on the front side of the substrate. This eliminates the need for cavity etching and epoxy filling, reducing manufacturing complexity while maintaining mechanical stability through direct mounting and electrical connection via vias. The substrate space is also optimized by eliminating the cavity structure.
3Strength
If magnetic functions are integrated in dielectric substrates using annealing to bond the magnetic disc, then mechanical bonding is achieved, but the dielectric material must support high annealing temperatures which limits material choices and increases cost
Solution Approach 1:
The patent replaces the thermal annealing process with a mechanical mounting approach where the magnetic disc is positioned and secured on the front side of the substrate using standard semiconductor packaging techniques. Electrical connections are established through vias that pass through the dielectric layer, eliminating the need for high-temperature annealing and expanding substrate material options to include various dielectric and flexible substrates that cannot withstand high temperatures.
4Volume of moving object
If the magnetic material disc is placed closer to the integrated circuit to reduce size, then the overall module size is reduced, but interconnecting losses may increase
Solution Approach 1:
The patent implements local quality optimization by using conductive vias with optimized geometry and material composition to connect the magnetic disc to the integrated circuit. The via structure is specifically designed with appropriate diameter, plating thickness, and fill material to minimize resistance and inductance. This allows the magnetic disc to be positioned close to the IC for compactness while maintaining low interconnecting losses through localized optimization of the connection structure.
Data Source
AI summary
An integration system and method for the manufacture of radio frequency transmission front-end modules with radio frequency integrated circuit(s) and self-biased magnetic component(s) integrated on a “Wafer Level Packaging”-type technology. This integration makes it possible to design efficient, compact and low-cost front-end modules.