Defect Analysis Using WOE Ranking for OLED Panel Fabrication

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Solution Overview

Problem

In the manufacturing of display panels, especially organic light emitting diode (OLED) panels, defects are difficult to trace due to the complex and integrated nature of the production process, often requiring manual data sorting based on experience, which is inefficient and unreliable.

Innovation Solution

A computer-implemented method for defect analysis that calculates weight-of-evidence (WOE) scores for device operations and contact areas to identify correlations with defects, ranking these to prioritize corrective actions, and an intelligent defect analysis system using distributed computing for predictive modeling and data visualization to quickly determine the root cause of defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual data sorting based on experience is used for defect analysis, then flexibility in handling complex defects is maintained, but analysis efficiency and reliability deteriorate

Engineering Contradiction:
Improvedefect analysis efficiencyVSAvoiddefect analysis reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces manual mechanical data sorting with an automated computer-implemented system that uses algorithms to calculate WOE scores, rank device operations, and identify defective devices. This substitution of manual analysis with automated computational methods directly improves both efficiency and reliability of defect analysis.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system enables self-service defect analysis by automatically processing fabrication data, calculating correlations between device operations and defects, and generating ranked lists of suspicious devices without requiring manual intervention. The automated system serves itself to identify root causes, improving productivity while maintaining reliability through consistent algorithmic application.

Inventive Principle:
Principle #25Self-service

2Measurement precision

If the complete fabrication process data is analyzed to trace defects, then accuracy of root cause identification is improved, but computational complexity and data processing time worsen

Engineering Contradiction:
Improveroot cause identification accuracyVSAvoiddata processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts only the most relevant features from the complete fabrication dataset by calculating WOE scores for each device operation and contact area. This extraction of critical information from the vast dataset improves root cause identification accuracy while reducing computational complexity by focusing only on high-correlation features rather than processing all raw data.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The system applies local quality analysis by evaluating each device operation and contact area individually through WOE score calculation, then ranking them by correlation strength. This localized assessment approach allows precise identification of defective devices while managing computational complexity through selective detailed analysis of only the most suspicious operations.

Inventive Principle:
Principle #3Local quality

3Loss of information

If WOE score calculation is performed for all device operations and contact areas, then completeness of defect correlation analysis is improved, but computational time and resources worsen

Engineering Contradiction:
Improvedefect correlation completenessVSAvoidanalysis time
Core Design Contradiction:
Loss of informationVSLoss of time

Solution Approach 1:

The patent performs WOE score calculation for all device operations and contact areas (excessive action to ensure completeness), but then applies threshold-based filtering to focus only on high-correlation results. This approach maintains complete defect correlation analysis while reducing subsequent processing time by eliminating low-relevance data from further examination.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS12061935B2Computer-implemented method for defect analysis, computer-implemented method of evaluating likelihood of defect occurrence, apparatus for defect analysis, computer-program product, and intelligent defect analysis system
Publication Date: 2024.08.13 BOE TECHNOLOGY GROUP CO LTD
  • US12061935B2 patent drawing
  • US12061935B2 patent drawing
  • US12061935B2 patent drawing

AI summary

A computer-implemented method for defect analysis is provided. The computer-implemented method includes calculating a plurality of weight-of-evidence (WOE) scores respectively for a plurality of device operations with respect to defects occurred during a fabrication period, a higher WOE score indicating a higher correlation between a defect and a device operation; and ranking the plurality of WOE scores to obtain a list of selected device operations highly correlated with the defects occurred during the fabrication period, device operations in the list of selected device operations having a WOE score greater than a first threshold score. A respective one of the plurality of device operations is a respective device defined by a respective operation site at which the respective device perform a respective operation.