Recycling Multilayer Wood Panels via Mechanical Layer Separation
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Solution Overview
Problem
Current recycling methods for multi-layer panels with a base layer made of wood material often result in the base layer being contaminated with adhesions, making it difficult to reuse as pure recyclable material, and existing methods shred the panels first, complicating the separation process.
Innovation Solution
A mechanical separation process is used to detach the top and bottom layers from the base layer, allowing the base layer to be recycled intact and free of adhesions, using milling or wedge cutting processes that preserve the shape and integrity of the base layer for further fiber processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If panels are completely shredded for recycling, then the recycling process can handle mixed materials, but the base layer becomes contaminated with adhesions and requires complex separation processes
Solution Approach 1:
The patent applies preliminary action by performing mechanical separation of layers before shredding the base layer. The cover layers are detached from the base layer using milling or wedge cutting processes, so that when the base layer is subsequently shredded for recycling, it is already free from adhesive contamination. This preliminary separation step simplifies the overall recycling process while maintaining versatility in handling different panel types.
2Manufacturing precision
If mechanical separation processes are used to separate layers, then the base layer can be recovered intact and pure, but the separation process requires precise control to avoid damaging the base layer
Solution Approach 1:
The patent applies the extraction principle by selectively removing only the cover layers from the panel structure while leaving the base layer intact. Using milling processes or wedge cutting, the cover layers are detached and removed, extracting the contamination elements without affecting the base layer. This approach recovers the base layer in its original form, ready for shredding and recycling, while maintaining manufacturing precision through controlled separation.
3Ease of operation
If adhesive layers are made flexible by heating, then layers can be separated without damage, but the process requires temperature control and energy input
Solution Approach 1:
The patent applies mechanical substitution by replacing thermal separation methods with purely mechanical separation processes. Instead of heating the adhesive layers to make them flexible for separation, the invention uses milling processes or wedge cutting to mechanically detach the cover layers from the base layer. This eliminates the need for temperature control and heating energy input, while still achieving complete layer separation without damage to the base layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the base layer to be recycled as a pure, intact material, reducing contamination and simplifying the recycling process, allowing for efficient reuse of the wood fibers in new products and minimizing the need for complex filtration or dissolution of adhesives.
Implementation Method 1
A mechanical separation process is used to detach the top and bottom layers from the base layer, allowing the base layer to be recycled intact and free of adhesions, using milling or wedge cutting processes that preserve the shape and integrity of the base layer
Data Source
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Figure 3
AI summary
The invention relates to a method for recycling a multi-layer panel (1, 1a) wherein the panel (1, 1a) has a base layer (2) made of a wood-based material and a top layer (3), wherein the top layer (3) is separated from the base layer (2) by a mechanical separation process, whereby the shape of the base layer (2) is retained and is subjected to a recycling process for the reuse of the base layer (3).