3D Wood Grain Board Surface Printing With Layered Data Alignment
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Solution Overview
Problem
Existing methods for creating three-dimensional wood grain on artificial boards struggle to accurately align the three-dimensional wood grain with the underlying printed image, leading to misalignment and increased production costs due to inflexible manufacturing processes.
Innovation Solution
A method involving the creation of a wood grain information database that separates underlying wood grain and three-dimensional wood grain datasets, allowing precise alignment through separate processing and printing of wood grain background color, shape, and depth data, followed by curing and embossing to form a three-dimensional wood grain layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional embossing methods are used to create three-dimensional wood grain, then the manufacturing process is simplified, but the alignment accuracy between the three-dimensional wood grain and the underlying printed image deteriorates
Solution Approach 1:
The patent divides the wood grain information into multiple independent datasets: underlying wood grain information (for the base layer) and three-dimensional wood grain information (for the embossed layer). This segmentation allows each layer to be processed and aligned independently, ensuring that the three-dimensional embossed pattern accurately corresponds to the underlying printed image, thereby resolving the alignment accuracy issue while maintaining manufacturing simplicity.
Solution Approach 2:
The patent applies the underlying wood grain information to the board surface first, establishing a reference base layer before applying the three-dimensional wood grain information. This preliminary action ensures that when the embossed layer is subsequently applied, it can be precisely aligned with the already-established base layer, solving the alignment problem without complicating the manufacturing process.
2Manufacturing precision
If separate processing of wood grain datasets is implemented to improve alignment accuracy, then the manufacturing process complexity increases
Solution Approach 1:
The patent uses a single embossing roller that performs multiple functions: it applies both the underlying wood grain information and the three-dimensional wood grain information in sequence, and it controls the embossing depth and pattern alignment through its design. This multi-functionality reduces the need for separate complex processing equipment, thereby maintaining simplicity while achieving high alignment accuracy.
3Quantity of substance
If traditional printing technology is used to create wood grain texture, then the production cost is reduced, but the realism and tactile quality of the wood grain deteriorates
Solution Approach 1:
The patent merges two-dimensional printed wood grain patterns with three-dimensional embossed wood grain structures in a single integrated board surface. This combination allows the product to maintain the cost-effectiveness of printing while adding the tactile realism and visual depth of embossing, thereby improving wood grain realism without proportionally increasing production cost.
Solution Approach 2:
The patent transitions from purely two-dimensional printed wood grain patterns to a three-dimensional structure by adding embossed depth information. This dimensionality change creates realistic wood grain texture that can be both seen and touched, significantly improving the realism and tactile quality of the wood grain effect while building upon the existing printed base layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high alignment accuracy between the three-dimensional wood grain and underlying image, reducing production costs and enabling customized production with improved efficiency and product diversity.
Implementation Method 1
a photopolymerization unit configured to irradiate the liquid resin layer to cure the liquid resin layer
Data Source
AI summary
The present invention relates to the field of surface structure preparation, particularly to a method for manufacturing a board having a three-dimensional wood grain on the surface thereof, which comprises at least the following steps: obtaining a wood grain pattern and processing it to extract a wood surface database, the database including at least an underlying wood grain printing dataset and a three-dimensional wood grain printing dataset. The first printing device outputs on the surface of the board using the underlying wood grain printing dataset to obtain an underlying wood grain layer matching the wood grain pattern, and the second printing device outputs wood grain precursor liquid above the underlying wood grain layer using the three-dimensional wood grain printing dataset to obtain a wood grain precursor matching the wood grain texture.