Subdivided Wordline Driver Circuitry Under Vertical Memory Arrays

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Solution Overview

Problem

Current memory devices face challenges in achieving higher integration levels and reducing semiconductor real estate usage, as existing architectures are not optimized for tightly packing wordline-driver-circuitry and memory arrays.

Innovation Solution

The integration of vertically-extending wordlines with wordline-driver-circuitry directly underneath, allowing for simultaneous activation of multiple wordlines and reducing the footprint by subdividing wordline-driver-circuitry amongst sub-wordline-driver units, which are configured to activate multiple wordlines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If wordline-driver-circuitry is integrated directly under vertically-extending wordlines, then area utilization improves and pitch is reduced, but circuitry packing density becomes more challenging

Engineering Contradiction:
Improvesemiconductor real estate footprintVSAvoidcircurty packing density
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The wordline-driver-circuitry is subdivided into multiple sub-wordline-driver units (SWD units), each responsible for activating a specific subset of wordlines. This segmentation allows the circuitry to be distributed underneath the vertically-extending wordlines, improving area utilization and reducing pitch while managing packing density through modular organization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a planar architecture to a three-dimensional architecture where wordlines extend vertically above the base. This vertical extension allows wordline-driver-circuitry to be positioned directly underneath the wordlines in the third dimension, achieving higher integration density without compromising circuitry functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If vertically-extending wordlines are used with circuitry underneath, then integration level increases, but manufacturing and design complexity increases

Engineering Contradiction:
Improveintegration levelVSAvoidarchitecture complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The wordline-driver-circuitry is divided into discrete sub-wordline-driver units, each handling specific wordline groups. This segmentation simplifies the design and manufacturing process by breaking down the complex integrated architecture into manageable, repeatable modules that can be systematically implemented.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each sub-wordline-driver unit is designed as a universal module capable of activating multiple wordlines simultaneously. This multi-functionality allows the same circuitry design to be replicated across different regions of the memory array, reducing design complexity while achieving high integration levels.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12178038B2Integrated assemblies having wordline-driver-circuitry directly under vertically-extending wordlines
Publication Date: 2024.12.24 MICRON TECHNOLOGY INC
  • US12178038B2 patent drawing
  • US12178038B2 patent drawing
  • US12178038B2 patent drawing

AI summary

Some embodiments include an integrated assembly having a CMOS-containing base containing wordline-driver-circuitry. The wordline-driver-circuitry is subdivided amongst horizontally-extending sub-wordline-driver (SWD) units. Memory cells are over the base, and are arranged in vertically-extending rows. Each of the memory cells includes an access device and a storage element coupled with the access device. Wordlines extend vertically along the rows. Each of the SWD units is associated with at least two of the wordlines and is configured to simultaneously activate the associated wordlines.