Workload Placement Selector for Data Center Thermal Management
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Solution Overview
Problem
Existing data center management systems fail to effectively distribute processing tasks based on temperature levels, leading to potential hot spots and inefficient heat dissipation in multi-processor data centers.
Innovation Solution
Implementing a system with temperature sensors and chillers that monitor and control temperature levels across the data center, using a workload placement selector to assign processing tasks to processors based on thermal conditions, along with other criteria like processor characteristics and power consumption goals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If processing tasks are distributed without considering temperature levels, then task execution speed is maintained, but hot spots form and heat dissipation becomes inefficient
Solution Approach 1:
The workload placement selector dynamically adjusts task distribution based on real-time temperature readings from sensors. As temperature conditions change in different data center zones, the system continuously reoptimizes task placement to maintain thermal balance while ensuring processing continuity, making the system adaptive rather than static
Solution Approach 2:
Temperature sensors act as intermediaries between the physical thermal environment and the digital task scheduling system. The sensors provide thermal data to the workload placement selector, which then translates this information into intelligent task routing decisions, bridging the gap between thermal monitoring and processing optimization
2Temperature
If multiple chillers are independently triggered based on local temperature sensors, then localized cooling is achieved, but temperature variance and hot spots persist
Solution Approach 1:
The workload placement selector serves multiple functions simultaneously: it optimizes processing efficiency, balances thermal distribution, and coordinates cooling resource utilization. By integrating these diverse objectives into a single decision-making system, the patent achieves unified control that prevents localized overheating while maintaining overall cooling efficiency
Solution Approach 2:
The system implements continuous feedback loops where temperature sensors monitor thermal conditions, the workload placement selector adjusts task distribution in response, and chillers modify cooling output based on resulting temperature changes. This closed-loop control ensures temperature uniformity is actively maintained rather than passively accepted
3Productivity
If processing tasks are concentrated in certain areas, then processing capacity is maximized, but heat generation creates hot spots
Solution Approach 1:
The system applies different task placement strategies to different spatial zones within the data center based on their specific thermal characteristics. Zones with better cooling capacity or lower current temperature can handle higher processing loads, while warmer zones receive fewer tasks, creating locally optimized quality of service that balances productivity with thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat distribution and reduces the likelihood of hot spots by optimizing task placement, maintaining temperature within acceptable ranges and enhancing overall data center efficiency and business goals.
Implementation Method 1
temperature sensors, e.g., thermocouples, thermometers
Implementation Method 2
Cooling devices, referred to herein as chillers, are positioned within the data center and operated, when needed or desired, to dissipate heat energy
Data Source
AI summary
Apparatus, and an associated method, for selecting at which processing unit of a plurality of processing units positioned at a data center that a processing task is to be performed. Temperature sensors are positioned throughout the data center and associated with the individual ones of the processing units. Indications of sensed temperature levels are collected and monitored by a collector and monitor. The indications of the sensed temperatures are used both pursuant to cooling operations, controlled by a cooling controller, and pursuant to processing-task placement, determined by a workload placement controller.