Semiconductor Workpiece Handling Calibration With Dual Imaging
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Solution Overview
Problem
Modern manufacturing processes for semiconductor packages rely heavily on human skill and expertise for quality control, alignment, and calibration, which is inefficient and costly.
Innovation Solution
A workpiece handling system with integrated lower and upper imaging devices and a transfer mechanism for automatic alignment and calibration, using imaging devices to determine and compensate for offsets in end effectors and carriers, enabling precise and automated calibration without manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated workpiece handling system is implemented, then productivity and manufacturing efficiency are improved, but device complexity increases
Solution Approach 1:
The patent replaces manual mechanical alignment and calibration operations with an automated imaging-based system. Imaging devices capture images of alignment marks on carriers and workpieces, and a controller automatically calculates and compensates for offsets, eliminating the need for manual measurement and adjustment tools.
Solution Approach 2:
The system performs self-calibration by using the imaging devices to automatically detect alignment marks and calculate offsets between carriers, end effectors, and the imaging devices themselves. The controller automatically generates compensation values without requiring external manual intervention, enabling the system to calibrate itself.
2Manufacturing precision
If manual calibration and alignment processes are used, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
Manual optical alignment tools and measurement devices are replaced with automated imaging devices that capture digital images of alignment marks. The controller automatically processes these images to determine precise positions and calculate offsets, achieving higher precision than manual methods while automating the process.
Solution Approach 2:
The system creates digital copies of alignment marks through imaging devices. These image copies are then processed by the controller to determine precise positions and calculate offsets, replacing physical measurement with digital analysis for improved precision and automation.
3Manufacturing precision
If automated offset compensation is implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system implements feedback by using imaging devices to continuously monitor the positions of alignment marks on carriers and workpieces. The controller calculates offsets based on these images and automatically generates compensation values that are applied to the transfer mechanism, creating a closed-loop control system for precise placement.
Solution Approach 2:
Physical measurement and manual calculation of offsets are replaced with automated imaging and digital processing. The imaging devices capture positions, the controller calculates offsets programmatically, and compensation is applied automatically, eliminating manual intervention while improving precision.
Data Source
AI summary
A workpiece handling system includes a carrier, a lower imaging device, and a transfer mechanism. The carrier is configured to carry at least one workpiece. The lower imaging device is disposed beside the carrier. The transfer mechanism is movably disposed over the lower imaging device and the carrier, wherein the transfer mechanism includes an end effector configured to pick and place the at least one workpiece and an upper imaging device disposed beside the end effector. A method of calibrating a workpiece handling system and a method of manufacturing a semiconductor package are also provided.