Workpiece Dicing Image Detection for Chip Fly-Off Analysis
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Solution Overview
Problem
Existing methods for processing workpieces to divide them into device chips often result in chip fly-offs, requiring manual analysis by operators to identify causes and implement countermeasures, which is inefficient and prone to errors.
Innovation Solution
A method and apparatus that captures images of the workpiece during processing, detects chip fly-off regions, and provides immediate warnings to operators about potential causes and countermeasures, including suggestions for cleaning the holding table, adjusting cutting water flow rates, and modifying processing speeds or cutting patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual analysis by operators is used to identify causes of chip fly-offs, then flexibility in problem-solving is maintained, but operational efficiency decreases and human errors increase
Solution Approach 1:
The patent replaces the manual mechanical analysis process with an automated image processing system. The system captures images of the workpiece, automatically detects chip fly-off regions through image processing, and identifies causes without human intervention, thereby eliminating manual errors and improving operational efficiency.
Solution Approach 2:
The system enables self-diagnosis by automatically analyzing captured images to detect chip fly-offs and identify their causes. The apparatus serves itself by providing automated detection and cause identification without requiring operator intervention, thus improving productivity and reducing human error.
2Productivity
If automated image processing is implemented to detect chip fly-offs, then operational efficiency improves, but device complexity increases
Solution Approach 1:
The image processing system performs multiple functions: capturing images of the workpiece, detecting chip fly-off regions, analyzing causes of chip fly-offs, and providing feedback. By consolidating these functions into a single integrated system, the patent achieves high detection efficiency while managing overall system complexity through multi-functionality.
3Measurement precision
If real-time image capture and analysis is performed, then chip fly-off detection accuracy improves, but processing time increases
Solution Approach 1:
The system performs preliminary actions by capturing images during or immediately after the dividing process, and pre-processes these images to detect chip fly-offs. By conducting detection and analysis in advance or in real-time during processing, the system achieves high detection accuracy without significant delays to the overall workflow.
Data Source
AI summary
A method of processing a workpiece to divide the workpiece into a plurality of device chips includes a dividing step of dividing a workpiece held on a holding table to produce a plurality of device chips from the workpiece, an image capturing step of capturing an image of the workpiece while the dividing step is being carried out or after the dividing step has been carried out, a detecting step of detecting from the image whether there is a chip fly-off from the workpiece or not and a chip fly-off region where a chip fly-off has occurred, and a warning step of warning of at least either one of a cause of the chip fly-off and a countermeasure against chip fly-offs.