Workpiece Two-Point Size Determination via Helical Projection

The patent transforms the measurement approach from multiple discrete revolutions (1D progression along the axis) to a continuous helical path (2D spiral trajectory). By measuring along a helix with defined pitch and radius, the system captures surface points continuously across multiple rotational positions and axial locations in a single scan, eliminating the need for multiple separate revolutions while maintaining comprehensive coverage for accurate two-point size determination.

The patent implements continuous measurement along a helical path where the probe continuously traces the workpiece surface without interruption. This continuous action captures measuring points across multiple revolutions and axial positions in one uninterrupted scan, contrasting with traditional methods that require stopping and re-aligning between discrete revolutions. The continuous helical measurement maintains measurement quality while dramatically reducing total measurement time.

The patent transitions from static, discrete measurement positions requiring manual re-alignment to a dynamic continuous helical measurement path. The probe dynamically traverses the workpiece surface along a spiral trajectory, automatically capturing points at varying circumferential and axial positions without requiring intervention for re-alignment. This dynamic approach simplifies the measurement process while maintaining comprehensive data collection for accurate two-point size determination.

The patent pre-defines the helical measurement path with specific pitch and radius parameters before measurement begins. This preliminary configuration establishes the complete measurement trajectory in advance, eliminating the need for real-time alignment decisions during measurement. The pre-planned helical path ensures consistent circumferential and axial coverage throughout the measurement process, simplifying operation while maintaining measurement precision.