Workpiece Holder for Crystal Orientation Correction in Wire Saw Slicing
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Solution Overview
Problem
The existing methods for slicing semiconductor silicon single crystal ingots using a wire saw face challenges with deviations in crystal orientation, leading to degraded slicing quality, increased costs due to the need for expensive wire saws with orientation adjustment mechanisms, and reduced productivity, especially when rigorous orientation standards are applied.
Innovation Solution
A workpiece holder that corrects deviations in both the x and y axis directions by tilting the workpiece plate, allowing for external setup adjustments without requiring a wire saw with an orientation adjustment mechanism, using a structure with protruding portions and tapered movable pieces to facilitate precise angle adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a wire saw with an orientation adjustment mechanism is used to correct crystal orientation deviations, then slicing quality is improved, but equipment cost and device complexity increase significantly
Solution Approach 1:
The workpiece plate is pre-adjusted to a tilted state before the slicing process begins. The tilt angle is set in advance to match the crystal orientation requirements, allowing the wire saw to slice along the correct crystal plane without needing an orientation adjustment mechanism during operation. This preliminary positioning resolves the contradiction by achieving precise slicing quality through pre-setup rather than complex real-time adjustment equipment.
2Measurement precision
If the workpiece is rotated on the pad plate to adjust crystal orientation in the y axis direction, then orientation accuracy is improved, but slicing quality degrades due to rotation-induced warping and waviness
Solution Approach 1:
Instead of rotating the workpiece on the pad plate to adjust orientation, the invention inverts the approach by tilting the workpiece plate itself to the required angle before bonding the workpiece. This eliminates the rotational motion that causes warping and waviness, while still achieving the necessary orientation accuracy through the tilted configuration of the workpiece plate relative to the wire saw's cutting direction.
3Ease of manufacture
If external setup adjustment is used to correct crystal orientation deviations, then equipment cost is reduced, but adjustment precision and reliability are insufficient for rigorous orientation standards
Solution Approach 1:
The workpiece plate is designed with adjustable tilt capability, allowing the orientation angle to be dynamically adjusted to match different crystal orientation requirements. This dynamic adjustment feature enables external setup methods to achieve high precision without requiring expensive wire saw orientation adjustment mechanisms, resolving the contradiction between equipment cost and orientation precision for rigorous standards.
Data Source
AI summary
A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.