Workpiece Overlay Compensation via Local Z-Shape Measurement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for manufacturing photomasks and other workpieces face challenges in achieving accurate overlay between layers due to workpiece deformation during patterning steps, which cannot be adequately compensated for using simple global parameters, especially in advanced multi-layer writing processes where precise alignment is critical.

Innovation Solution

The method involves acquiring the Z-shape of the workpiece before and after patterning, calculating compensation values based on these measurements, and updating the reference grid to compensate for distortions, allowing for improved alignment between layers without introducing additional alignment marks or affecting absolute registration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If simple global parameters are used for alignment compensation, then the process is simple, but overlay accuracy deteriorates due to workpiece deformation

Engineering Contradiction:
Improvealignment compensation processVSAvoidoverlay accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent divides the workpiece surface into multiple measurement regions with local alignment marks, allowing separate measurement and compensation of deformation in each region. This segmentation enables accurate capture of local distortions that global parameters cannot detect, resolving the contradiction between simple process and high overlay accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local measurement and compensation strategies where each region of the workpiece is measured and compensated independently based on its specific deformation characteristics. This local quality approach allows the system to adapt to varying deformation patterns across different areas, achieving high overlay accuracy without requiring complex global compensation models.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If additional alignment marks are introduced to improve measurement accuracy, then overlay precision improves, but device complexity and process complexity increase

Engineering Contradiction:
Improveoverlay precisionVSAvoidalignment mark structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent designs alignment marks that serve multiple functions: they act as both measurement references for deformation detection and as part of the functional pattern itself. This multi-functionality reduces the need for separate dedicated alignment marks, thereby improving overlay precision without significantly increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The workpiece structure itself provides the alignment marks through its inherent features, eliminating the need for additional external alignment elements. The existing structural features are utilized as measurement references, allowing the workpiece to serve its own alignment needs without adding extra components.

Inventive Principle:
Principle #25Self-service

3Device complexity

If rigid body assumption is made for workpiece, then calculation is simplified, but measurement precision deteriorates due to ignoring deformation

Engineering Contradiction:
Improvecalculation processVSAvoidalignment measurement accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent transitions from assuming rigid body parameters to measuring and compensating for actual deformation parameters by acquiring Z-shape data at multiple points. This parameter change allows the system to account for workpiece deformation while maintaining manageable calculation complexity through systematic data acquisition and processing methods.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8137875B2Method and apparatus for overlay compensation between subsequently patterned layers on workpiece
Publication Date: 2012.03.20 MICRONIC LASER SYST AB
  • US8137875B2 patent drawing
  • US8137875B2 patent drawing
  • US8137875B2 patent drawing

AI summary

Methods and apparatuses for patterning workpieces are provided. The methods and apparatuses described herein improve overlay between subsequently patterned layers on a workpiece by introducing an improved alignment method that compensates for workpiece distortions.