Thermally Conductive Elastomeric Composites With Worm-Like Fillers
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Solution Overview
Problem
Thermally conductive elastomeric materials require high volumes of fillers to achieve effective thermal conductivity, which negatively impacts other properties like softness and compression set, and increases costs, while fillers like graphite and boron nitride exhibit anisotropic conductivity, making it challenging to achieve high thermal conductivity in the thickness direction of electronic device components.
Innovation Solution
A composition comprising a continuous phase of ethylene/α-olefin or propylene/α-olefin interpolymer elastomer matrix, a discontinuous phase of crosslinked elastomer, and a thermally conductive filler, where the crosslinked elastomer domains disrupt the orientation of fillers, enhancing thermal conductivity in the thickness direction without increasing filler content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high volume of thermally conductive filler is added to increase thermal conductivity, then thermal conductivity is improved, but other properties such as softness, compression set, and compound viscosity deteriorate
Solution Approach 1:
The patent changes the morphology parameter of the filler from conventional platelet shape to worm-like shape. This parameter change allows the filler to form a three-dimensional network structure at lower volume fractions, achieving high thermal conductivity without the negative effects of high filler loading such as increased viscosity and degraded compression set properties
Solution Approach 2:
The patent creates a composite material system combining worm-like thermally conductive filler particles with elastomeric matrix. The unique worm-like morphology enables formation of a percolating thermal network at low filler concentrations, producing a composite that achieves high thermal conductivity while maintaining acceptable mechanical properties and processing characteristics
2Temperature
If high volume of thermally conductive filler is added to increase thermal conductivity, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the morphology parameter of the filler from conventional platelet shape to worm-like shape. This parameter change allows the filler to form a three-dimensional network structure at lower volume fractions, achieving high thermal conductivity without the negative effects of high filler loading such as increased viscosity and degraded compression set properties
Solution Approach 2:
The patent creates a composite material system combining worm-like thermally conductive filler particles with elastomeric matrix. The unique worm-like morphology enables formation of a percolating thermal network at low filler concentrations, producing a composite that achieves high thermal conductivity while maintaining acceptable mechanical properties and processing characteristics
3Temperature
If conventional platelet shaped fillers like graphite and boron nitride are used, then intrinsic thermal conductivity is high, but thermal conductivity in thickness direction is reduced due to anisotropic orientation
Solution Approach 1:
The patent inverts the conventional approach by using worm-like shaped filler instead of platelet shaped filler. The worm-like morphology with its elongated structure promotes three-dimensional thermal conduction pathways including through-thickness direction, reversing the anisotropic orientation problem inherent in platelet fillers and enabling effective heat dissipation in the thickness direction
Solution Approach 2:
The patent changes the morphology parameter of the filler from conventional platelet shape to worm-like shape. This parameter change allows the filler to form a three-dimensional network structure at lower volume fractions, achieving high thermal conductivity without the negative effects of high filler loading such as increased viscosity and degraded compression set properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves twice the thermal conductivity in the thickness direction compared to materials without crosslinked elastomer domains, while maintaining acceptable compression set and Shore A hardness, thus improving heat dissipation in electronic devices with reduced filler content.
Implementation Method 1
these fillers have intrinsically anisotropic (directionally dependent) thermal conductivity. When added to an elastomer material during flow processing, they tend to orient and provide a much higher Tc in the plane (or flow) direction than in the thickness direction of the material
Implementation Method 2
thermally conductive fillers, which can also be electrically insulating or electrically conductive, are typically added to an elastomeric material to increase thermal conductivity (Tc)
Data Source
AI summary
A composition composed of a crosslinked interpolymer elastomer and thermally conductive filler dispersed within an elastomeric matrix, thermally conductive articles made from the composition, and methods of producing the composition and articles.