Wound Capacitor Pin Guide Structure for Capillary Bonding Reliability
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Solution Overview
Problem
Existing wound capacitor technologies lack effective methods for firmly fixing or bonding conductive pins to circuit substrates, leading to potential circuit breaks and inadequate shock resistance.
Innovation Solution
A wound capacitor package structure with a conductive assembly and a bottom seat plate that includes specific gaps and guide channels for conductive pins, allowing for capillary action to secure the pins to the substrate, enhancing shock resistance and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wound capacitor structures are used, then the device can be manufactured with conventional methods, but the conductive pins cannot be firmly fixed to the circuit substrate leading to potential circuit breaks
Solution Approach 1:
The patent replaces traditional mechanical bonding methods (soldering, welding) with capillary action-based bonding. The conductive pins are positioned within guide channels that create capillary channels, allowing bonding material to be drawn in automatically through capillary forces, eliminating the need for complex mechanical bonding processes while ensuring reliable electrical connection
Solution Approach 2:
The patent introduces guide channels as an intermediary structure between the conductive pins and the circuit substrate. These guide channels serve as capillary channels that mediate the bonding process by controlling the flow of bonding material through capillary action, ensuring precise and reliable fixation without direct mechanical contact
2Strength
If conductive pins are firmly bonded to the substrate, then shock resistance is improved, but the structure becomes more complex with guide channels and gaps
Solution Approach 1:
The guide channels serve multiple functions simultaneously: they provide structural support for the conductive pins, create capillary channels for bonding material flow, define precise positioning gaps, and protect the bonding interface. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity while achieving improved shock resistance
Solution Approach 2:
The patent applies local quality by creating specific gap dimensions (5-50 micrometers) only where needed at the bonding interface between conductive pins and substrate. The guide channels are precisely formed with controlled dimensions only in the critical bonding regions, maintaining simple structures in non-critical areas while ensuring reliable shock resistance where required
3Reliability
If capillary action is used for bonding, then firm fixation is achieved, but precise gap control (5-50 micrometers) is required
Solution Approach 1:
The guide channels are pre-formed with precise dimensions during the capacitor manufacturing process, establishing the exact gap dimensions (5-50 micrometers) before the bonding operation. This preliminary structuring eliminates the need for precise gap control during the actual bonding process, as the capillary channels self-regulate the bonding material flow based on their pre-defined geometry
Solution Approach 2:
The capillary channels perform self-service by automatically regulating the bonding material flow through capillary forces. The specific gap dimensions create inherent capillary pressure that draws bonding material into the channels without external control, self-correcting for minor variations in positioning and ensuring reliable bonding without requiring high manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure ensures firm fixation of conductive pins, improving shock resistance and preventing circuit breaks, particularly in vehicles, by utilizing capillary action for secure bonding.
Implementation Method 1
the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material into the first gap defined between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate through capillary action, and the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material into the second gap defined between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate through capillary action
Data Source
AI summary
A movable device and a wound capacitor package structure. A first gap defined between a first exposed portion of a first conductive pin and an inner surface of a first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a first exposed height defined from a bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm. A second gap defined between a second exposed portion of a second conductive pin and an inner surface of a second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.