Wound Capacitor Package Structure to Prevent Pin Offset and Moisture Paths
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Solution Overview
Problem
Existing wound capacitor technologies face issues where the filling body can be squeezed by a single-piece packaging casing, and the conductive pins can become offset relative to the wound assembly, leading to potential moisture paths and structural instability.
Innovation Solution
A wound capacitor package structure featuring a packaging assembly with a filling body composed of a bottom and top filling material layer, encapsulating the wound assembly and conductive pins, and a single-piece packaging casing with an annular upright and deformation structure that accommodates these layers, preventing squeezing and offsetting of the conductive pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-piece packaging casing is used to encapsulate the wound assembly, then the packaging structure is simplified and manufacturing is easier, but the filling body can be squeezed and the conductive pins can become offset relative to the wound assembly
Solution Approach 1:
The packaging casing is divided into a bottom packaging portion and a side packaging portion that are separately formed and then assembled together. This segmentation allows each portion to be optimized independently: the bottom portion provides stable support for the wound assembly while the side portion provides protective enclosure without squeezing the filling body, thereby resolving the contradiction between manufacturing simplicity and structural stability.
Solution Approach 2:
A fixing structure is introduced as an intermediary component between the bottom packaging portion and the wound assembly. This fixing structure includes fixing protrusions that engage with the wound assembly and fixing cavities in the bottom packaging portion, creating a stable connection that prevents offset of conductive pins while maintaining the benefits of the segmented packaging design.
2Object-affected harmful factors
If the packaging casing completely encapsulates the wound assembly, then protection is improved, but the conductive pins cannot be properly positioned and secured
Solution Approach 1:
The bottom packaging portion is designed with localized features including fixing cavities and positioning protrusions at specific locations to secure the wound assembly and conductive pins, while the rest of the packaging structure provides general protection. This local quality approach ensures precise pin positioning is achieved where needed without compromising overall encapsulation protection.
Solution Approach 2:
The packaging structure employs asymmetric design where the bottom packaging portion has a different configuration from the side packaging portion. The bottom portion includes specific fixing features and positioning structures that are not present in the side portion, allowing precise control of conductive pin positions while maintaining comprehensive protection against moisture and environmental factors.
Data Source
AI summary
A mobile device and a wound capacitor package structure thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly and a packaging assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging assembly includes a filling body for completely encapsulating the wound assembly, and a single-piece packaging casing for accommodating the filling body. The filling body includes a bottom filling material layer configured to encapsulate the wound assembly and a part of the conductive assembly. The single-piece packaging casing has an annular deformation structure configured for surroundingly accommodating the top filling material layer. The top filling material layer of the filling body cannot be squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly cannot be offset relative to the wound assembly by the annular deformation structure.