Wound Sintering Sheet for Semiconductor Bonding Efficiency

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Solution Overview

Problem

Conventional sintering bonding techniques for semiconductor devices involve inefficient application of a pasty sinterable particle composition, poor conveyability, and storage stability issues due to the flat paper-like form of the sheet for sintering bonding, leading to operational inefficiencies and storage challenges.

Innovation Solution

A wound body of a sheet for sintering bonding with a base material, where the sheet is coiled around a winding core, comprising an electrically conductive metal containing sinterable particles and a binder component, allowing for successive transfer and improved registration efficiency, reduced exposure to air, and enhanced storage stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a flat paper-like sheet for sintering bonding is used, then the material can be supplied to semiconductor chips, but the conveyability is poor and operational efficiency is reduced

Engineering Contradiction:

Improveoperational efficiencyVSAvoidconveyability

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

The patent transforms the flat paper-like sheet into a wound body with a curved, roll-like structure. This curvature enables the sheet to be fed continuously through processing equipment, improving conveyability and operational efficiency compared to handling individual flat sheets

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Productivity

If a flat paper-like sheet for sintering bonding is used, then the material can be transferred to chips, but registration requires defining at least two directions which reduces operational efficiency

Engineering Contradiction:

Improveregistration efficiencyVSAvoidregistration complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The wound body structure provides a natural feed direction along the roll axis, simplifying registration to primarily one direction (along the length of the unrolled sheet). This reduces the complexity of defining multiple registration directions required for flat sheets

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Reliability

If a flat paper-like sheet for sintering bonding is used, then the material can be stored, but the area exposed to atmospheric air becomes larger reducing storage stability

Engineering Contradiction:

Improvestorage stabilityVSAvoidexposed surface area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The wound body structure creates a compact, rolled configuration that minimizes the surface area exposed to atmospheric air during storage. The rolled form acts as a protective configuration, reducing oxidation and degradation compared to flat sheets with large exposed surfaces

Inventive Principle:

Principle #30Flexible shells and thin films

4Reliability

If a flat paper-like sheet for sintering bonding is used, then the material can be stored, but a large storing space is required reducing storage efficiency

Engineering Contradiction:

Improvestorage stabilityVSAvoidstorage space

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The wound body structure compacts the sheet material into a dense roll, dramatically reducing the volume required for storage compared to flat sheets that require large planar space. The rolled configuration allows efficient stacking and compact storage arrangements

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wound body design enhances operational efficiency, storage stability, and storage efficiency by enabling successive transfer of the sintering material, reducing exposure to air, and minimizing storage space requirements.

Implementation Method 1

a heating step is carried out under predetermined temperature and pressurization conditions such that volatilization of the solvent and the like in the material for sintering bonding occurs between the supporting substrate and the semiconductor chip thereon, and sintering between sinterable particles proceeds. Due to this, a sintered layer is formed between the supporting substrate and the semiconductor chip

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 2

a heating step is carried out under predetermined temperature and pressurization conditions such that volatilization of the solvent and the like in the material for sintering bonding occurs

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Data Source

PatentUS11697567B2Wound body of sheet for sintering bonding with base material

Publication Date: 2023.07.11 NITTO DENKO CORP

AI summary

To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.