WPCB Material Value Scoring Using Dual Energy X-Ray Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for recycling Waste Printed Circuit Boards (WPCBs) are inefficient and inaccurate due to reliance on visual examination, which is time-consuming and error-prone, and fail to provide comprehensive value estimation, especially for double-sided boards, as they cannot analyze both sides simultaneously and are not robust in dirty or dusty environments.
Innovation Solution
An apparatus and method using dual energy or spectral x-ray imaging to determine material value scores by analyzing both sides of WPCBs, combined with machine learning for component detection and elemental analysis, enabling accurate valuation of recoverable metals and efficient sorting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If visual examination by human experts is used to estimate WPCB value, then the evaluation can be performed, but the process is time-consuming and error-prone
Solution Approach 1:
The patent replaces the mechanical visual examination system (human experts) with an automated imaging and analysis system. The system uses visible light imaging to capture PCB images, processes them through image analysis algorithms, and automatically estimates material values, eliminating the time-consuming and error-prone manual inspection process while maintaining or improving accuracy.
Solution Approach 2:
The patent creates a digital copy of the physical PCB through imaging. By capturing the visual appearance, component layout, and structural features in image form, the system can analyze multiple copies simultaneously without requiring physical handling or sequential human inspection, thereby reducing evaluation time while preserving measurement precision.
2Loss of information
If only one side of double-sided WPCBs is analyzed at a time using visible light imaging, then the imaging process is simple, but the information obtained is incomplete
Solution Approach 1:
The patent transitions from two-dimensional surface imaging to three-dimensional structural analysis by incorporating X-ray imaging capabilities. This allows the system to penetrate the PCB structure and visualize components on both sides simultaneously, as well as detect hidden features such as embedded traces, vias, and internal component arrangements, thereby completing the information without proportionally increasing device complexity.
Solution Approach 2:
The patent integrates multiple imaging functions into a single system that can handle both single-sided and double-sided PCBs. The imaging system is designed to automatically adapt to different PCB configurations, using appropriate imaging modes (visible light for surface components, X-ray for internal structures) to comprehensively analyze both sides of the board without requiring separate specialized equipment for each function.
3Reliability
If conventional imaging methods are used in dirty or dusty environments, then the equipment is simple, but the imaging quality deteriorates
Solution Approach 1:
The patent employs imaging parameters and processing techniques that are insensitive to environmental contamination. By using X-ray imaging with appropriate energy levels and detection algorithms that can penetrate dust and dirt layers, the system maintains reliable imaging quality in dirty or dusty environments without requiring complex environmental control measures or frequent cleaning interventions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid, accurate determination of material value scores, improving the evaluation of WPCBs for recycling by analyzing all components regardless of orientation and environmental conditions, thus enhancing the efficiency and accuracy of material recovery.
Implementation Method 1
dual energy or spectral x-ray image of the waste printed circuit board
Implementation Method 2
dual energy or spectral x-ray image
Data Source
AI summary
Apparatus and method for assigning a material value score to a waste printed circuit board or a portion thereof and system for sorting waste printed circuit boards.