XBAR Filter Dielectric Layer Split for Spurious Mode Suppression

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Solution Overview

Problem

Current RF filters using acoustic wave resonators are not well-suited for higher frequency communications bands, such as those defined in the 5G NR standard, particularly for bands n77 and n79, and millimeter wave frequencies, due to limitations in handling transmit power and achieving sufficient frequency separation between shunt and series resonators, leading to inefficient spurious mode excitation.

Innovation Solution

The use of transversely-excited film bulk acoustic resonators (XBARs) with a back-side dielectric frequency-setting layer, which helps in reducing spurious modes by adjusting the thickness of the dielectric layer on the back side, thereby improving the electromechanical coupling and frequency separation between shunt and series resonators.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single dielectric layer is used for frequency setting, then the structure is simple, but the frequency separation between shunt and series resonators is insufficient and spurious modes are excited

Engineering Contradiction:
Improvedielectric layer structureVSAvoidfrequency separation
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The single dielectric layer is divided into two separate dielectric layers: a first dielectric layer on the front side and a second dielectric layer on the back side of the piezoelectric substrate. This segmentation allows independent optimization of each layer's thickness to achieve sufficient frequency separation between shunt and series resonators while preventing spurious mode excitation, thereby resolving the contradiction between structural simplicity and frequency separation performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The frequency setting function is extended from a single-dimensional approach (one dielectric layer) to a two-dimensional approach by adding dielectric layers on both the front and back sides of the piezoelectric substrate. This dimensional expansion provides additional degrees of freedom in frequency control, enabling independent adjustment of resonant frequencies for both shunt and series resonators to achieve the required frequency separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the dielectric layer thickness is increased to improve frequency separation, then frequency separation improves, but spurious modes are excited

Engineering Contradiction:
Improvefrequency separationVSAvoidspurious modes
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

By dividing the total dielectric thickness into two separate layers on opposite sides of the piezoelectric substrate, the frequency setting function is distributed. This allows the first and second dielectric layers to be independently optimized such that their combined effect achieves the required frequency separation while each individual layer maintains a thickness that prevents spurious mode excitation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different dielectric layers are positioned at different locations (front side and back side) with potentially different thicknesses optimized for their local functions. The first dielectric layer on the front side and the second dielectric layer on the back side can have different thickness values tailored to control specific resonant modes, allowing frequency separation improvement without triggering spurious modes.

Inventive Principle:
Principle #3Local quality

3Speed

If higher frequency bands are used for 5G communications, then bandwidth increases, but transmit power handling capability decreases

Engineering Contradiction:
ImprovefrequencyVSAvoidtransmit power handling
Core Design Contradiction:
SpeedVSPower

Solution Approach 1:

The dual-sided dielectric layer configuration provides additional control dimensions for resonator design at higher frequencies. By independently adjusting the thickness of the first and second dielectric layers, the resonant frequencies can be precisely controlled to achieve the required frequency separation even at millimeter-wave frequencies, enabling 5G bandwidth requirements to be met while maintaining power handling capability through optimized electromechanical coupling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention changes the physical parameters of the resonator structure by introducing two dielectric layers with different thicknesses on opposite sides of the piezoelectric substrate. This parameter modification allows precise control of resonant frequencies and electromechanical coupling coefficients, enabling the resonator to operate effectively at higher 5G frequency bands while maintaining adequate transmit power handling capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of XBARs with a back-side dielectric frequency-setting layer effectively reduces spurious modes and enhances the electromechanical coupling, enabling the design of high-performance RF filters capable of handling higher frequency bands with improved bandwidth and reduced spurious mode excitation.

Implementation Method 1

a plate of piezoelectric material

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

adjusting the thickness of the dielectric layer on the back side, thereby improving the electromechanical coupling and frequency separation between shunt and series resonators

Methodology Applied
Scientific EffectElectromechanical coupling:

Data Source

PatentUS11374549B2Filter using transversely-excited film bulk acoustic resonators with divided frequency-setting dielectric layers
Publication Date: 2022.06.28 MURATA MFG CO LTD
  • US11374549B2 patent drawing
  • US11374549B2 patent drawing
  • US11374549B2 patent drawing

AI summary

Acoustic filters and methods of fabrication are disclosed. A filter device includes a substrate and a single-crystal piezoelectric plate, a back surface of the piezoelectric plate attached to a surface of the substrate. The filter device includes a plurality of acoustic resonators including one or more shunt resonators and one or more series resonators. Each of the plurality of acoustic resonators includes an interdigital transducer (IDT) formed on the front surface of the piezoelectric plate, interleaved fingers of the IDT disposed on a respective diaphragm formed by a respective portion of the piezoelectric plate that spans a respective cavity in the substrate. A divided frequency setting layer is formed on at least some of the one or more shunt resonators but not on the one or more series resonators.