Xenon-Filled Aerogel Insulation for Cooler Device Surfaces
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Solution Overview
Problem
Consumer electronic devices are limited in performance by the temperature of their exterior surfaces due to insufficient thermal insulation, with existing aerogels having thermal conductivities similar to or higher than air, leading to discomfort for users when the ergonomic limit is exceeded.
Innovation Solution
Aerogels enriched with gases having lower thermal conductivity than air, such as xenon, are used in conjunction with a polymer seal to mitigate gas leakage, resulting in significantly lower thermal conductivity and improved insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional aerogels are used for thermal insulation, then the material provides basic insulation, but the thermal conductivity is similar to or higher than air, resulting in insufficient insulation performance
Solution Approach 1:
The patent changes the physical parameter of thermal conductivity by filling aerogel pores with xenon gas instead of air or vacuum. Xenon has lower thermal conductivity than air, and when confined within the aerogel pore structure, it achieves superior thermal insulation performance while maintaining the aerogel's mechanical properties.
Solution Approach 2:
The patent creates a composite structure combining aerogel framework with xenon gas filling. This composite material leverages both the low thermal conductivity of xenon and the porous structure of aerogel to achieve enhanced insulation performance that neither material could provide alone.
2Temperature
If aerogel pores are left empty or filled with air, then the structure remains simple, but thermal insulation is insufficient due to air's higher thermal conductivity
Solution Approach 1:
The patent transforms the pore filling parameter from air or vacuum to xenon gas. This parameter change enables superior thermal insulation while the process complexity is managed through controlled gas introduction methods that maintain the aerogel structure's integrity.
3Reliability
If aerogel is used without gas enrichment, then the manufacturing process is simple, but the thermal insulation performance is insufficient for high-performance electronic devices
Solution Approach 1:
The patent modifies the aerogel's thermal properties by introducing xenon gas into the pore structure. This parameter change enhances insulation performance to levels suitable for high-performance electronic devices, with the manufacturing process adapted to accommodate the gas enrichment step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of xenon-enriched aerogels with polymer seals allows electronic devices to operate at higher junction temperatures without exceeding ergonomic limits, enhancing user comfort and device performance.
Implementation Method 1
a gas in at least one of the plurality of pores, the gas having a lower thermal conductivity than air
Implementation Method 2
including a polymer seal to mitigate gas leakage
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
Aerogel including low thermal conductivity gases and related apparatus and methods are disclosed. An example aerogel disclosed herein includes a framework including a plurality of pores and a gas in at least one of the plurality of pores, the gas having a lower thermal conductivity than air.