XPU Socket Compression Structure for Uniform PCB Pin Loading
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Solution Overview
Problem
The lateral spacing between tensile elements and contact areas on printed circuit boards (PCBs) creates force moments that lead to uneven loading of pins, resulting in warpage and under-loaded pins, which compromises the communication between the PCB and installed devices.
Innovation Solution
A PCB with a socket having pins arranged in a peripheral configuration around a pin-less area, such as an aperture, to ensure even loading of pins, combined with a second force couple that compresses a heat sink against the processor package independently of the first force couple, optimizing the load distribution and contact pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If tensile elements are placed at locations laterally spaced away from the contact area, then the device structure is avoided from damage, but force moments are created causing uneven pin loading and warpage
Solution Approach 1:
The patent transitions from a conventional planar pin arrangement to a three-dimensional peripheral pin configuration around an aperture. This dimensional change allows the pins to be positioned at the periphery of the contact area, creating a more favorable mechanical leverage distribution that reduces force moments while maintaining structural integrity.
Solution Approach 2:
The patent employs an asymmetric pin arrangement where pins are positioned peripherally around an aperture rather than in a symmetric grid pattern. This asymmetric configuration optimizes the mechanical advantage for load distribution, reducing warpage while maintaining device strength.
2Manufacturing precision
If a peripheral pin arrangement around an aperture is used, then pin loading uniformity is improved, but the socket structure complexity increases
Solution Approach 1:
The socket structure is segmented into distinct functional zones: a peripheral pin arrangement zone, a central aperture zone, and supporting structural zones. This segmentation allows each zone to be optimized independently - the peripheral pins for uniform loading and the central aperture for reduced force moments - while simplifying the overall design through functional separation.
3Device complexity
If a single force couple is used to compress the processor package, then the structure is simpler, but independent adjustment of contact pressures is not possible
Solution Approach 1:
The compression system is segmented into two independent force couples: a first force couple for compressing the processor package against the socket, and a second force couple for compressing the heat sink against the processor package. This segmentation enables independent adjustment of each compression force, allowing optimization of electrical contact pressure and thermal contact pressure separately.
Solution Approach 2:
The processor package serves as an intermediary element between the first force couple (electrical connection) and the second force couple (thermal connection). This intermediary structure allows the two force couples to operate independently while both acting through the same component, enabling separate optimization of electrical and thermal interfaces.
Data Source
AI summary
An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.