X-Ray Detector Interconnect Assembly Without ACF Bonding
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Solution Overview
Problem
X-ray detectors face issues with interconnect failures, high manufacturing costs, and complex assembly processes due to the use of anisotropic conductive film (ACF) connections, which are non-permanent and require skilled technicians, leading to increased scrap rates and production costs.
Innovation Solution
The implementation of non-permanent interconnects with flexible substrates, such as polyimide or polyethylene terephthalate, using passive electrical connections, compression contacts, high-density connectors, and multiplexers to improve reliability, reduce scrap, and simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive film (ACF) is used to bond the interconnect to the substrate, then electrical connections can be established, but the connection is non-permanent and has a high failure rate
Solution Approach 1:
The patent removes the ACF bonding layer from the interconnect assembly, extracting the problematic element that caused non-permanent connections. The interconnect is directly bonded to the substrate without ACF, eliminating the source of connection failures while simplifying the assembly process.
Solution Approach 2:
The patent employs a flexible interconnect with a limited number of bend cycles (approximately 100 bends) that is designed to be replaced rather than repaired. This disposable approach eliminates complex repair processes and ensures reliable connections through standardized, low-cost interconnects that are replaced when wear occurs.
2Ease of manufacture
If ACF bonding is used to connect the interconnect to the substrate, then electrical connections are established, but skilled technicians are required and manufacturing costs increase
Solution Approach 1:
The patent eliminates the ACF bonding process entirely, removing the step that required skilled technicians for alignment and bonding. Direct bonding of the interconnect to the substrate simplifies the manufacturing process while improving connection reliability through permanent bonds.
Solution Approach 2:
The flexible interconnect is designed to self-align with the substrate through its flexibility and compliance, eliminating the need for skilled manual alignment. The interconnect naturally conforms to the substrate surface during bonding, enabling automated manufacturing processes.
3Productivity
If ACF bonding is used for the interconnect, then connections can be made, but scrap rates increase due to attachment failures
Solution Approach 1:
By removing the ACF bonding process, the patent eliminates the primary source of attachment failures that caused high scrap rates. The direct bonding approach significantly improves manufacturing yield by preventing the bonding failures inherent in ACF-based assemblies.
Solution Approach 2:
The use of inexpensive, replaceable flexible interconnects designed for a limited service life allows for high-volume, low-cost manufacturing. Failed interconnects are simply replaced rather than repaired, maintaining high productivity through standardized replacement procedures.
4Reliability
If permanent interconnects are used, then reliability improves, but adaptability for component replacement decreases
Solution Approach 1:
The patent employs a flexible interconnect that is permanently bonded to the substrate but can be dynamically replaced as a complete unit. The flexibility of the interconnect allows it to accommodate thermal expansion and mechanical stress, maintaining reliable connections while enabling straightforward replacement of the entire interconnect assembly when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces interconnect failure rates, simplifies manufacturing, and lowers costs by allowing for automation and easier component replacement, while maintaining reliable electrical connections.
Implementation Method 1
An interconnect including readout electronics may be bonded to the substrate with an anisotropic conductive film (ACF)
Data Source
AI summary
Some embodiments include an x-ray detector, comprising: a substrate including: a plurality of pixels; configured to convert incident x-ray into electrical signals; a plurality of data lines coupled to the pixels; a printed circuit assembly (PCA) including: a circuit configured to convert the electrical signals into digitized data; and an interconnect electrically connected between the data lines and the circuit and configured to transfer the electrical signals from the substrate to the PCA.