Four-Side Buttable X-Ray Detector Module Assembly
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Solution Overview
Problem
Conventional computed tomography scanners require large X-ray detectors that are difficult to assemble without gaps, and there is a need for cost-effective manufacturing methods and detectors that can operate at high count rates.
Innovation Solution
A module assembly with a four-side buttable configuration using a system-in-package structure comprising interposers and an integrated circuit, allowing easy adaptation to different X-ray sensor designs and enabling efficient signal processing and temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large X-ray detector is assembled using four side buttable modules, then the detector area is increased, but gaps between modules and manufacturing complexity increase
Solution Approach 1:
The large X-ray detector is divided into four separate buttable modules, each with identical connection interfaces. This segmentation allows the detector to be manufactured and tested as smaller units, then assembled into a large-area detector without gaps between modules, resolving the contradiction between increasing detector area and managing assembly complexity
Solution Approach 2:
Each module is designed with universal connection interfaces that can be assembled in multiple configurations (four-side buttable design). The standardized interfaces enable any module to connect to any other module, simplifying the assembly process and reducing the complexity of creating gapless large-area detectors
2Device complexity
If the integrated circuit is directly mounted to the X-ray sensor, then the device complexity is reduced, but the adaptability to different sensor designs is limited
Solution Approach 1:
An interposer is introduced as an intermediary layer between the integrated circuit and the X-ray sensor. This interposer provides standardized connection interfaces and can be easily adapted to different sensor designs by modifying only the interposer, while the integrated circuit remains unchanged. This resolves the contradiction by maintaining simple device structure while enabling high adaptability to different sensor configurations
Solution Approach 2:
The interposer allows parameter changes in the connection interface dimensions and configurations without requiring changes to the integrated circuit. By changing the interposer design parameters, the system can adapt to different sensor designs, maintaining low device complexity while achieving high versatility
3Ease of manufacture
If conventional assembly methods are used for large X-ray detectors, then manufacturing costs increase, but the detection capability remains limited
Solution Approach 1:
The detector is segmented into four identical modules that can be manufactured using standardized processes. This segmentation enables cost-effective manufacturing through repetition and standardization, while the ability to assemble these modules into a large-area detector maintains high detection capability, resolving the contradiction between manufacturing cost and detection performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the construction of large X-ray detectors with seamless pixelated areas, reduces manufacturing costs, and improves yield and thermal management, facilitating high-count-rate operations.
Implementation Method 1
an X-ray sensor being configured to receive a photon of the X-ray radiation and to provide an electrical signal in response to the received photon
Data Source
AI summary
A module assembly for the detection of X-ray radiation includes an X-ray sensor being configured to receive a photon of the X-ray radiation and to provide an electrical signal in response to the received photon. The module assembly further includes a system-in-package structure for processing the electrical signal, the system-in-package structure including an input/output terminal, a first interposer and a second interposer and an integrated circuit which are arranged in a stacked configuration in the system-in-package structure. The package structure can be assembled on all four lateral sides and is thus four-side buttable so that contiguous modules can be mounted on all four sides without a gap between pixels to read out data from large-pixelated detectors of the X-ray sensor.