Digital X-ray Detector GIP Driver Integration and Sealing

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Solution Overview

Problem

Existing digital X-ray detectors face challenges in minimizing bezel size and protecting the gate-in-panel (GIP) driver from X-ray damage, which limits imaging resolution and increases the size of the contact portion with the imaging target.

Innovation Solution

The integration of a GIP driver directly over the array panel, with a scintillator layer overlaying the transistor region to minimize X-ray damage, and a sealing layer that does not cover the side face of the base substrate to reduce bezel size, allowing for improved imaging resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a gate driver and readout circuitry are attached as an integrated circuit to the bezel region, then the driver functionality is provided, but the bezel size increases

Engineering Contradiction:

Improvedriver functionalityVSAvoidbezel size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The gate driver and readout circuitry are merged with the array panel by fabricating them using the same thin-film transistor process on the same substrate. This integration eliminates the need for separate IC components and reduces the bezel area required for mounting external drivers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The array panel substrate serves multiple functions: it acts as both the imaging sensor substrate and the mounting platform for the gate driver and readout circuitry. This multi-functionality eliminates the need for separate dedicated driver substrates or mounting areas.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If the GIP driver is integrated onto the array panel, then the bezel size is minimized, but the GIP driver becomes vulnerable to X-ray damage

Engineering Contradiction:

Improvebezel sizeVSAvoidX-ray damage to driver

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

A scintillator layer is introduced as an intermediary substance between the X-ray source and the GIP driver. This scintillator converts X-rays into visible light, creating a protective barrier that shields the sensitive transistor region from direct X-ray exposure while allowing the driver to function.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful X-ray radiation is converted into beneficial visible light through the scintillator layer. The X-rays that would otherwise damage the GIP driver are transformed into light signals that can be processed by the imaging system, turning a harmful factor into a useful one.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If a sealing layer covers the entire base substrate including side faces, then sealing characteristics are improved, but the bezel size increases

Engineering Contradiction:

Improvesealing characteristicsVSAvoidbezel size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The sealing layer is applied selectively only to regions requiring sealing protection, rather than covering the entire substrate uniformly. This localized sealing approach provides adequate protection for sensitive areas while minimizing the overall sealed area and reducing bezel size.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The sealing structure is segmented into discrete regions rather than forming a continuous full-coverage layer. This segmentation allows sealing to be applied only where necessary for protecting electronic components, eliminating redundant sealing material and reducing bezel area.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes bezel size, reduces X-ray-induced damage to the GIP driver, and enhances imaging resolution by forming the GIP driver as part of the array panel and using a scintillator layer to protect the transistor region, while maintaining sufficient sealing characteristics.

Implementation Method 1

a scintillator layer disposed over the PIN diode and the GIP driver so as to overlay the active region and at least a portion of the GIP region

Methodology Applied

Scientific EffectScintillation: Scintillation

Data Source

PatentUS11199635B2Digital X-ray detector, digital X-ray detection device, and manufacturing method thereof

Publication Date: 2021.12.14 LG DISPLAY CO LTD

AI summary

A digital X-ray detector, a digital X-ray detection device and a manufacturing method thereof are discussed. The digital X-ray detector includes a base substrate including an active region including a plurality of pixel regions, and a gate-in-panel (GIP) region as at least one side region to the active region; a PIN diode disposed in the active region and over the base substrate; a GIP driver disposed in the GIP region and over the base substrate; and a scintillator layer disposed over the PIN diode and the GIP driver so as to overlay the active region and at least a portion of the GIP region. In the present invention, damage of the driver due to X-ray is minimized while a bezel size is minimized.