Semiconductor X-Ray Detector Layout for Heat and Resolution
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Solution Overview
Problem
Current semiconductor X-ray detectors face challenges in large-area and high-pixel production due to cumbersome heat management, which affects their efficiency and spatial resolution.
Innovation Solution
The design involves semiconductor radiation detectors with a continuous radiation absorption layer on one strip of a semiconductor wafer and an electronics layer on another strip, bonded longitudinally, with vias and redistribution layers for electrical connections, allowing for efficient detection and processing of X-ray signals without a scintillator, enabling improved heat management and spatial resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If semiconductor X-ray detectors use direct conversion of X-ray into electric signals, then spatial resolution is improved, but heat management becomes cumbersome
Solution Approach 1:
The detector is divided into multiple independent pixel elements arranged in an array, with each pixel handling a small portion of the X-ray flux. This segmentation distributes the heat generation across many small units rather than concentrating it, making thermal management more manageable while maintaining high spatial resolution through the pixelated structure
Solution Approach 2:
A specialized readout integrated circuit (ROIC) is introduced as an intermediary component that interfaces with the pixel array. The ROIC handles signal processing and heat dissipation, acting as a mediator between the X-ray detection function and thermal management requirements, allowing the detector to achieve both high resolution and acceptable heat management
2Area of stationary object
If the detector area is increased for large-area applications, then detection coverage is improved, but heat management difficulty increases
Solution Approach 1:
The large-area detector is segmented into multiple smaller pixel elements organized in an extended array. Each pixel element independently processes X-rays and generates signals, distributing the total heat generation across many small units. This allows the detector to cover large areas while maintaining manageable heat levels through the modular pixel structure
Solution Approach 2:
The detector architecture transitions to a two-dimensional pixel array structure, allowing area expansion in the lateral dimensions rather than increasing detector thickness. This dimensional approach enables large detection coverage while keeping each pixel's heat generation manageable, as heat dissipation is optimized at the pixel level rather than requiring management of a large monolithic volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the detection efficiency and spatial resolution of X-ray images, facilitating the production of large-area, high-pixel detectors suitable for various applications including medical imaging and cargo scanning.
Implementation Method 1
When an X-ray photon is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated
Implementation Method 2
When an X-ray photon is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated
Implementation Method 3
Semiconductor X-ray detectors largely overcome this problem by direct conversion of X-ray into electric signals
Data Source
AI summary
Disclosed herein is an image sensor and a method of making the image sensor. The image sensor may comprise one or more packages of semiconductor radiation detectors. Each of the one or more packages may comprise a radiation detector that comprises a radiation absorption layer on a first strip of semiconductor wafer and an electronics layer on a second strip of semiconductor wafer. The radiation absorption layer may be continuous along the first strip of semiconductor wafer with no coverage gap. The first strip and the second strip may be longitudinally aligned and bonded together. The radiation detector may be mounted on a printed circuit board (PCB) and electrically connected to the PCB close to an edge of the radiation detector.