X-ray Detector Layered Construction Through-Contacts
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Solution Overview
Problem
Current medical x-ray detectors face challenges in achieving high spatial and spectral resolution while minimizing radiation dose, as indirect detectors often have lower effective spatial resolution and direct-converting detectors are hindered by solder contacting methods that can damage semiconductor materials and limit full coverage due to wiring requirements.
Innovation Solution
The use of a layered construction with detection elements, read-out boards, and a base board, where detection elements are electrically contacted via first solder contacts and read-out boards are contacted with the base board via second solder contacts, utilizing through-contacts to eliminate the need for wiring and maintain high spatial resolution across the detector surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder contacting is used between the electrodes on the semiconductor and the read-out board, then electrical connection is achieved, but the high melting point of widely-used solders adversely affects semiconductor materials and their crystal structure
Solution Approach 1:
The patent changes the temperature parameter by using low-melting-point solder (melting point below 150°C) instead of conventional high-melting-point solder. This parameter change allows the soldering process to occur at temperatures that do not damage the semiconductor crystal structure, thereby resolving the contradiction between achieving reliable electrical connection and avoiding harm to the semiconductor material.
2Reliability
If wiring is used to connect the read-out board to the base board, then electrical connection is achieved, but the entire read-out board cannot be covered by directly converting semiconductor material and cutouts must be provided
Solution Approach 1:
The patent extracts the wiring function from the read-out board design by using through-contacts that pass through the read-out board substrate. This allows the read-out board to be completely covered by the directly converting semiconductor material without requiring cutouts for wire connections, thereby maintaining full spatial resolution and coverage while still achieving electrical connection to the base board.
3Area of stationary object
If the size of individual semiconductor detection elements is increased to reduce the number of cutouts needed, then large contiguous flat-panel detectors can be constructed, but the resolution is significantly reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar connection approach to a three-dimensional approach by using through-contacts that extend through the read-out board substrate. This dimensional change allows electrical connections to be made without creating cutouts in the detector plane, enabling large-area detectors to maintain full spatial resolution across the entire active area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for full coverage with high spatial and spectral resolution, enhancing radiation sensitivity in the relevant spectral range and minimizing adverse effects on semiconductor materials, thereby improving the resolution and sensitivity of medical imaging devices.
Implementation Method 1
the detection element or each detection element is electrically contacted via a plurality of first solder contacts
Implementation Method 2
the read-out board or each read-out board is contacted with the base board via a plurality of second solder contacts
Data Source
AI summary
An imaging device for electromagnetic radiation, especially for x-ray and/or gamma radiation, is disclosed. In an embodiment, the imaging device includes a layering including a number of detection elements, a number of read-out boards and a base board. Each of the detection elements is electrically contacted with a respective read-out board via a plurality of first solder contacts. Each read-out board includes a plurality of through-contacts and is electrically contacted with the base board via a plurality of second solder contacts.