Digital X-ray Detector Multi-Contact Hole Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing digital x-ray detectors face issues with defective contacts due to leakage currents and complex fabrication processes, which degrade image quality and increase production costs, primarily because of the need for multiple masking processes and unreliable contact holes.
Innovation Solution
A digital x-ray detector with a multi-contact hole structure that strengthens electrical connections between upper and lower electrodes, reducing the number of masking processes required in fabrication and enhancing contact hole reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple masking processes are used to form contact holes, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The contact hole formation process is divided into multiple sequential steps: forming first contact holes through the first insulating layer, forming second contact holes through the second insulating layer, and forming third contact holes through the third insulating layer. Each contact hole type serves a specific electrical connection function, ensuring reliable multi-layer electrical connectivity while maintaining a systematic fabrication approach.
Solution Approach 2:
The patent introduces a vertical multi-layer structure with three insulating layers and corresponding contact holes at different depth levels. This three-dimensional contact hole arrangement allows electrical connections to be established through multiple vertical levels, improving connection reliability by providing redundant pathways and better electrical contact without requiring excessive lateral process complexity.
2Reliability
If multiple masking processes are used to form contact holes, then electrical connection reliability is improved, but manufacturing time and cost increase
Solution Approach 1:
The first, second, and third insulating layers are formed and positioned in advance before the contact holes are created. This preliminary layer formation allows subsequent contact hole patterning to proceed more efficiently, as the structural framework is already in place, reducing overall fabrication time despite the multiple contact hole formation steps.
Solution Approach 2:
The contact hole formation is segmented into three distinct types (first, second, and third contact holes) formed through different insulating layers, allowing each type to be optimized for its specific electrical connection function while maintaining a modular fabrication sequence that improves overall process efficiency.
3Ease of manufacture
If a single contact hole structure is used, then fabrication process is simpler, but leakage current increases
Solution Approach 1:
The electrical connection path is segmented into multiple contact holes (first, second, and third contact holes) distributed across three different insulating layers. This segmentation creates multiple isolated electrical contact points that reduce leakage current by providing controlled, discrete connection pathways rather than a single continuous contact path.
Solution Approach 2:
The first, second, and third insulating layers serve as intermediary barriers between electrical contacts. These insulating layers isolate and control the electrical fields between contact holes, preventing unwanted leakage current while maintaining necessary electrical connections through the structured multi-layer design.
4Object-generated harmful factors
If contact holes are formed through thick insulating layers, then electrical isolation is improved, but contact hole reliability decreases
Solution Approach 1:
The total insulating thickness is segmented into three separate insulating layers, each with its own contact holes. This segmentation allows each individual layer to maintain adequate electrical isolation thickness while the contact holes provide reliable electrical connections through each layer, balancing isolation performance with connection reliability.
Solution Approach 2:
The patent transitions from a single thick insulating layer to a multi-layer vertical structure, distributing the electrical isolation function across three vertical levels. This three-dimensional arrangement maintains sufficient insulation thickness for electrical isolation while creating multiple contact opportunities that improve overall contact hole reliability through redundancy and better electrical contact at each level.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-contact hole structure improves the reliability of contact holes, reduces leakage currents, and simplifies the fabrication process, leading to enhanced image quality and cost-effectiveness by minimizing the number of masking steps from eight to seven.
Implementation Method 1
The light conductive film 2 internally forms an electrical signal, namely, pairs of electrons-holes 7, in proportion to external signal strength such as incident electric waves or magnetic waves. Namely, the light conductive film 2 serves as a converter that converts an external signal, especially, x-ray, into an electrical signal.
Data Source
AI summary
A digital x-ray detector and its fabrication method are disclosed to strengthen an electrical connection between an upper electrode and a lower by employing a multi-contact hole structure and obtaining reliability of a contact hole by electrically connecting the side of the lower line and the upper electrode. A semiconductor layer is inserted at a lower portion of the contact hole to prevent damage of a gate insulating layer possibly caused by an overetch to thus reduce a defective contact.