X-ray Detector Thermal Isolation via PCB Back Cover Mounting
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Solution Overview
Problem
Existing X-ray detectors face challenges in heat transfer isolation between digital PCBs and optical sensing panels without dedicated thermal isolators, which are bulky, or alternative solutions that complicate the structure and hinder heat dissipation.
Innovation Solution
The digital PCB is directly bonded to the back cover of the X-ray detector, creating a gap between it and the optical sensing panel fixed by an internal support, leveraging internal air convection and the back cover as a heat transfer path to reduce temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a dedicated thermal isolator structure is provided between digital PCB and optical sensing panel, then heat transfer isolation is improved, but device thickness increases
Solution Approach 1:
The patent removes the dedicated thermal isolator structure from between the digital PCB and optical sensing panel. Instead, the digital PCB is directly mounted to the back cover, extracting the thermal isolation function from a separate component and redistributing it through the existing structural elements (back cover and gap space).
Solution Approach 2:
The patent utilizes the gap dimension between the digital PCB and optical sensing panel as a thermal isolation pathway. By mounting the digital PCB to the back cover rather than directly to the support structure, a spatial gap is created that serves as a thermal barrier, converting a dimensional space into a functional thermal isolation mechanism.
2Object-affected harmful factors
If metal poles are added between back cover and digital PCB support, then heat transfer blocking is improved, but device complexity increases
Solution Approach 1:
The patent eliminates the metal pole thermal isolation structures and their associated mounting mechanisms. The thermal isolation function is extracted from these complex mechanical elements and achieved instead through the simplified configuration of direct PCB-to-back-cover mounting combined with the inherent gap space.
Solution Approach 2:
The patent merges the digital PCB mounting function directly to the back cover structure, combining multiple functions (structural support, thermal isolation, and electrical connection) into a single integrated configuration, thereby reducing the number of separate components and simplifying the overall device structure.
3Strength
If digital PCB is mounted on internal support, then structural support is improved, but heat transfer to optical sensing panel increases
Solution Approach 1:
The back cover serves as an intermediary element between the digital PCB and the internal support structure. By mounting the digital PCB to the back cover rather than directly to the internal support, the back cover mediates the thermal and mechanical relationships, providing structural support while preventing direct heat transfer pathways to the optical sensing panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively isolates heat transfer, reduces the thermal resistance between the PCB and the environment, and decreases the optical sensing panel's temperature, enhancing thermodynamic performance and maintaining imaging quality.
Implementation Method 1
leveraging internal air convection and the back cover as a heat transfer path to reduce temperatures
Implementation Method 2
the back cover as a heat transfer path to reduce temperatures
Data Source
AI summary
An X-ray detector and a heat dissipating method are provided. The heat dissipating method comprises providing an optical sensing panel over an internal support of the X-ray detector and providing a digital printed circuit board directly on a back cover, so that there is a gap between the digital printed circuit board and the optical sensing panel that is fixed by the internal support. The X-ray detector comprises an optical sensing panel bonded to the outer side of an internal support; and a digital printed circuit board bonded to the inner side of a back cover, wherein there is a gap between the digital printed circuit board and the optical sensing panel that is fixed by the internal support.