X-Ray Beam Divergence Control for Scan-Free 2D Measurement
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Solution Overview
Problem
Conventional X-ray inspection systems for semiconductor structures with complex three-dimensional architectures face limitations due to the use of one-dimensional sensors that require mechanical scanning for full-area data acquisition, leading to increased system complexity and reduced effectiveness in real-time inspection and high-speed production line applications.
Innovation Solution
An X-ray measurement system incorporating an X-ray source, optical mirror assembly, divergence angle control element, and two-dimensional detector, which allows for focused X-ray beams with adjustable divergence angles to be generated and captured, eliminating the need for mechanical scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If one-dimensional sensors are used with mechanical scanning to acquire full-area data, then linear detection accuracy is improved, but system complexity increases and productivity decreases
Solution Approach 1:
The patent transitions from one-dimensional linear scanning to two-dimensional area detection by using a two-dimensional detector array. This allows simultaneous acquisition of data across the entire sample area without mechanical scanning, thereby improving productivity while maintaining measurement precision through the high-resolution capabilities of the 2D detector.
Solution Approach 2:
The patent eliminates mechanical scanning movements and enables continuous data acquisition across the entire field of view simultaneously. The two-dimensional detector captures full-area information in a single exposure, ensuring continuous useful action without interruptions for positioning or scanning, thus significantly improving inspection throughput.
2Loss of information
If mechanical scanning is used to acquire multiple linear data, then complete image data is obtained, but system complexity increases and positioning accuracy requirements become more stringent
Solution Approach 1:
The patent replaces the mechanical scanning approach with a two-dimensional detector that simultaneously captures complete image data across the entire field of view. This eliminates the need for mechanical scanning movements and positioning adjustments, thereby reducing system complexity while ensuring complete information acquisition without data loss.
Solution Approach 2:
The patent extracts and eliminates the mechanical scanning subsystem from the overall system. By using a two-dimensional detector that inherently captures area information, the patent removes the need for separate mechanical scanning mechanisms, positioning systems, and associated control systems, thereby significantly reducing device complexity.
3Measurement precision
If one-dimensional sensors perform gradual scanning, then linear detection is achieved, but real-time inspection effectiveness is limited
Solution Approach 1:
The patent enables real-time inspection by using a two-dimensional detector that simultaneously captures complete area information without mechanical scanning. This allows immediate data acquisition and processing, making the system suitable for real-time inspection applications while maintaining the high linear detection accuracy through the precision of the 2D detector array.
Solution Approach 2:
The patent achieves continuous and immediate data acquisition across the entire field of view using the two-dimensional detector. This eliminates the intermittent nature of mechanical scanning and enables continuous monitoring and real-time inspection, significantly improving ease of operation while preserving measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables rapid, high-resolution, and high-efficiency data acquisition with improved throughput and reproducibility, suitable for real-time inspection and analysis of semiconductor structures without mechanical movement, supporting non-destructive characterization of nanomaterials and thin film stacks.
Implementation Method 1
The optical mirror assembly is configured to focus the incident X-ray beam at a predetermined position
Implementation Method 2
The X-ray source is configured to generate an incident X-ray beam
Data Source
AI summary
An X-ray measurement system and an X-ray measurement method. An X-ray source is configured to generate an incident X-ray beam. An optical mirror assembly is configured to focus the incident X-ray beam at a predetermined position. A divergence angle control element is disposed between the optical mirror assembly and the predetermined position. The divergence angle control element has a first portion and a second portion that are spaced apart from each other by a predetermined distance. At least a portion of the focused incident X-ray beam passes between the first portion and the second portion. A two-dimensional detector is configured to receive a measurement X-ray beam generated from a test object that is irradiated by the focused incident X-ray beam, and the measurement X-ray beam has a divergence angle that varies with the predetermined distance.