High-Aspect Ratio X-Ray Grating Production via Anodic Oxidation
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Solution Overview
Problem
Conventional methods for producing high-aspect ratio X-ray metal grating structures, such as those used in X-ray imaging devices, are costly due to the use of dry etching techniques, and wet etching processes struggle to create perpendicular side surfaces, leading to undercut issues.
Innovation Solution
A method involving the formation of pores in a substrate using anodic oxidation, followed by plugging and wet etching to create a high-aspect ratio structure with perpendicular side surfaces, allowing for the production of X-ray metal grating structures with absorptive and transmissive portions suitable for X-ray imaging devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dry etching is used to form high-aspect ratio structures, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
A protective film is formed on the substrate surface before etching. This protective film serves as a mask that prevents lateral etching and guides the etchant to etch only in the depth direction through the openings, thereby achieving perpendicular side surfaces in advance before the actual high-aspect ratio structure is formed
Solution Approach 2:
A protective film is introduced as an intermediary element between the etchant and the substrate. This protective film mediates the etching process by selectively allowing etching only in the vertical direction through its openings, while protecting the lateral surfaces from etching, thus achieving perpendicular side surfaces without requiring expensive dry etching equipment
2Ease of manufacture
If wet etching is used to reduce production cost, then production cost decreases, but manufacturing precision deteriorates due to undercut formation
Solution Approach 1:
A protective film is formed on the substrate surface before etching. This protective film serves as a mask that prevents lateral etching and guides the etchant to etch only in the depth direction through the openings, thereby achieving perpendicular side surfaces in advance before the actual high-aspect ratio structure is formed
Solution Approach 2:
A protective film is introduced as an intermediary element between the etchant and the substrate. This protective film mediates the etching process by selectively allowing etching only in the vertical direction through its openings, while protecting the lateral surfaces from etching, thus achieving perpendicular side surfaces without requiring expensive dry etching equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective production of high-aspect ratio structures with perpendicular side surfaces, reducing production costs and improving the performance of X-ray imaging devices by enhancing X-ray absorption and phase contrast capabilities.
Implementation Method 1
forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface
Data Source
AI summary
A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.