X-ray Inspection Tool for 3D Defect Classification
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Solution Overview
Problem
Current methods for classifying defects in three-dimensional vertical memory devices are inefficient, requiring over 30 minutes per defect and involving multiple tool transfers, as they rely on surface markings and sequential imaging with SEM and FIB tools, which are slow and labor-intensive.
Innovation Solution
An x-ray inspection tool system using a transmission-mode x-ray source and detector to acquire diffraction patterns and coherent images of volume defects within three-dimensional structures, enabling fast classification and training of additional inspection tools for improved defect identification and yield monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional SEM and FIB tools are used for defect classification, then defect identification can be achieved, but the process takes over 30 minutes per defect and involves multiple tool transfers
Solution Approach 1:
The patent replaces the mechanical/sequential inspection process (multiple tool transfers, sequential imaging) with a unified optical/x-ray imaging system that captures three-dimensional defect information in a single measurement, eliminating the need for repeated physical handling and tool switching while maintaining classification accuracy
Solution Approach 2:
The inspection system integrates multiple imaging capabilities (optical imaging, x-ray imaging, three-dimensional reconstruction) into a single multi-functional platform that can perform defect detection, localization, and classification simultaneously, replacing the need for separate SEM, FIB, and optical microscopes
2Reliability
If multiple tool transfers are performed for defect inspection, then comprehensive defect analysis is possible, but the process becomes labor-intensive and time-consuming
Solution Approach 1:
The patent merges multiple separate inspection tools (optical microscope, SEM, FIB) into a single integrated inspection system that combines optical imaging, x-ray imaging, and three-dimensional reconstruction capabilities, reducing the number of discrete devices from multiple to one while maintaining comprehensive analysis capability
Solution Approach 2:
The inspection system segments the defect analysis process into distinct functional modules (optical imaging module, x-ray imaging module, three-dimensional reconstruction module, classification module) that operate within a single integrated platform, allowing comprehensive analysis without requiring physical transfer between separate tools
3Measurement precision
If FIB tool is used to expose defect sites, then deep defects can be accessed, but the process removes material slowly at 10 nm per cut and requires repeated imaging
Solution Approach 1:
The patent replaces the slow mechanical material removal process of FIB (10 nm per cut) with non-contact x-ray imaging that penetrates deep into the substrate to access and image defects at any depth instantly, eliminating the time-consuming sequential cutting and imaging cycles
Solution Approach 2:
The system performs preliminary three-dimensional reconstruction and defect localization using x-ray imaging before any material removal is attempted, allowing the inspection process to identify and classify defects without requiring sequential FIB cutting, thereby eliminating the repeated imaging cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid imaging and classification of defects to better than 10 nm resolution, significantly reducing classification time and improving the efficiency of defect identification in three-dimensional structures, while training additional tools for high-volume manufacturing.
Implementation Method 1
configured to measure one or more x-ray diffraction patterns from one or more volume defects contained within a three-dimensional structure of a sample
Data Source
AI summary
X-ray imaging and classification of volume defects within a three-dimensional structure includes identifying one or more volume defects within a three-dimensional structure of a sample and acquiring, with a transmission-mode x-ray diffraction imaging tool, one or more coherent diffraction images of the one or more identified volume defects. The process includes classifying the one or more volume defects within a volume of the three-dimensional structure based on the one or more coherent diffraction images, and training an additional optical or electron-based inspection tool based on the one or more classified defects.